Polysilicon fuse monitoring structure and monitoring method
A polysilicon fuse and fusing technology, used in fuse testing, instruments, electrical components, etc., can solve problems such as the inability to monitor whether the surrounding devices or circuits are affected, the inability to provide customer design guidelines, and the inability to obtain other devices.
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[0020] The polysilicon fuse monitoring structure described in the present invention is generally placed in the scribing groove area of the chip. Such as figure 2 As shown, it includes a polysilicon fuse 101 with a specific length and width (determined according to the actual demand of the product). The two ends of the polysilicon fuse 101 have a first lead-out area 102 and a second lead-out area 103. The first lead-out area 102 and the second lead-out area 103 The second lead-out area 103 is a multi-layer metal structure, and each layer of metal is connected by a through hole 104 and an interlayer connection hole 105; the first lead-out area 102 and the second lead-out area 103 also have a first test terminal 201 and a second Test terminal 202;
[0021] A conductive ring band surrounds 106 to surround the polysilicon fuse 101, the first lead-out area 102, and the second lead-out area 103, and the conductive ring band 106 maintains a certain distance D from the polysilicon ...
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