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Transparent conductive substrate fabrication method, transparent conductive substrate and electrostatic capacitance-type touch panel

A transparent conductive and transparent substrate technology, applied in transparent dielectrics, printed circuit manufacturing, cable/conductor manufacturing, etc., which can solve problems such as disappearance of conductivity, pattern collapse, and inability to ensure patterns.

Inactive Publication Date: 2014-12-31
OSAKA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for printing, a binder resin is required, and in order to ensure transparency, it is necessary to reduce the amount of silver nanoparticles and silver nanowires used, so the binder resin used will cover the surface of silver nanoparticles and silver nanowires. , especially in the case of silver nanowires, there is a problem that the conductivity disappears
In addition, in the case of not using a binder resin, there is a problem that the pattern cannot be secured at the time of printing, or even if the pattern can be barely secured immediately after printing, the pattern will not be fixed when the solvent contained in the ink composition is dried. collapse

Method used

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  • Transparent conductive substrate fabrication method, transparent conductive substrate and electrostatic capacitance-type touch panel
  • Transparent conductive substrate fabrication method, transparent conductive substrate and electrostatic capacitance-type touch panel
  • Transparent conductive substrate fabrication method, transparent conductive substrate and electrostatic capacitance-type touch panel

Examples

Experimental program
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Effect test

no. 1 Embodiment approach

[0045] figure 1 An example of a manufacturing process of the transparent conductive substrate for a capacitive touch panel according to the embodiment is shown. exist figure 1 In this process, while pulling out the transparent substrate (transparent film substrate) 10 from the substrate roll 12, the X electrode (corresponding to the first electrode) is used to form the X electrode (corresponding to the first electrode) on one main surface of the transparent film substrate 10 with the lead electrode pattern forming part 14. The electrode uses a lead electrode pattern. The routing electrode pattern for the X electrode is, for example, Figure 9 pattern shown. The X electrode lead electrode pattern forming unit 14 forms a X electrode lead electrode pattern by a printing method such as screen printing, gravure printing, or flexo printing using a known conductive paste, and then dries it. Here, as a drying method, heating by an oven, heating by pulse light irradiation, etc. ar...

no. 2 Embodiment approach

[0088] Figure 5 Another example of the manufacturing process of the transparent conductive substrate for the capacitive touch panel according to the embodiment is shown in figure 1 The same elements are marked with the same reference numerals. exist Figure 5 In this example, while pulling out the first transparent film substrate 10a from the first substrate roll 12a, the lead electrode pattern forming part 14 for the X electrode (corresponding to the first electrode) is placed on one main part of the first transparent film substrate 10a. Form the lead electrode pattern for the X electrode on the surface, and dry it.

[0089] On the main surface of the first transparent film substrate 10 a on which the X electrode routing electrode pattern is formed, the X electrode pattern forming unit 16 forms an X electrode pattern using the transparent conductive pattern forming ink. This X-electrode pattern is formed so as to be connected to the aforementioned X-electrode routing ele...

Embodiment 1

[0112] Make the following sequence with Figure 7 , Figure 8 The patterns shown are transparent conductive substrates. in addition, Figure 7 The pattern is as follows: 25 rhombuses (obtained by tilting the square at 45°C) are connected in a row along the horizontal direction of the figure in the connection area, and triangles obtained by removing half of the rhombus are connected at both ends of the row. 45 rows are arranged in the vertical direction of the figure, and the upper and lower rows are not electrically connected. in addition, Figure 8 The pattern is as follows: 45 rhombuses are connected in a column along the vertical (up and down) direction of the figure in the connection area, and at one end of the column (in Figure 8 The lower end in the center) is connected to the triangle obtained by removing half of the rhombus, and such columns are arranged in 25 columns along the horizontal direction of the figure, and the left and right columns are not electrically...

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Abstract

Provided are the following: a method that does not involve vacuum processing or wet etching, and uses a simple construction method for fabricating a transparent conductive substrate with high pattern recognition for use in an electrostatic capacitance-type touch panel; a transparent conductive substrate; and an electrostatic capacitance type touch panel. A lead out electrode pattern for an electrode is formed on at least one of the main surfaces of a transparent film using conductive paste; an electrode pattern is printed in the electrode pattern forming section using ink for forming transparent conductive patterns that contains metal nanowires or metal nanoparticles so that the electrode pattern connects with the electrode lead out electrode pattern, and then the electrode pattern is dried; and then, after drying, the electrode pattern is irradiated with pulsed light in an irradiation unit (18) to sinter the metal nanowires or metal nanoparticles contained in the transparent conductive pattern forming ink.

Description

technical field [0001] The invention relates to a manufacturing method of a transparent conductive substrate, a transparent conductive substrate and an electrostatic capacitive touch panel. More specifically, it relates to a method of manufacturing a transparent conductive substrate suitable for a capacitive touch panel, a transparent conductive substrate for a capacitive touch panel, and a capacitive touch panel. Background technique [0002] In recent years, as various electronic devices such as mobile phones, portable terminals, and personal computers have become more advanced or diversified, a technology is being used in which a light-transmitting touch panel is mounted on the front of the display panel of the electronic device. Each function of the electronic device can be switched by pressing the surface of the touch panel with a finger or a pen while recognizing the display content of the display panel on the back side through the touch panel. [0003] As such a touc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/041G06F3/044H01B5/14H01B13/00H05K3/12
CPCG06F2203/04103G06F3/0445G06F3/0446H05K1/097H05K3/1283H05K2201/0108H05K2203/107G06F3/041G06F3/044H01B5/14H01B13/0009H05K3/12H05K3/1208H05K3/1291H05K3/28
Inventor 菅沼克昭内田博篠崎研二
Owner OSAKA UNIV
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