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Stirring apparatus of silicon wafer grinding liquid

A technology of stirring device and grinding liquid, applied in mixers with rotary stirring device, transportation, packaging, dissolving, etc., can solve the problems of uneven force, unqualified silicon wafer quality, high labor intensity, etc.

Inactive Publication Date: 2014-12-31
CHANGZHOU LIWEI KNIFE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, manual agitation is generally used for the abrasive liquid required for silicon wafer processing. Due to manual agitation, the force is uneven and the agitation is uneven, and it is difficult to meet the molding requirements of silicon wafers, so that the quality of the silicon wafers produced cannot be achieved. Up to the standard; In addition, manual mixing, labor intensity is high, and work efficiency is low

Method used

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  • Stirring apparatus of silicon wafer grinding liquid

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Embodiment Construction

[0011] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0012] see figure 1 , a stirring device for silicon wafer grinding fluid, comprising a mixing tank body 3 with a liquid inlet 1 and a liquid outlet 2, the silicon wafer grinding fluid to be ground is added into the mixing tank body from the liquid inlet, and can be fed from the outlet The liquid flows out from the mouth, and a connection cover 4 is provided at the upper end of the mixing barrel body. The connection cover 4 is fixedly connected to the mixing barrel body through bolts, and the stirring motor 5 is fixedly arranged on the connection cover 4, so that the connection cover forms a support for the stirring motor. Regardless of whether the stirring motor is working or stopped, it is very firm; the output shaft of the stirring motor is connected to the stirring main shaft 6 through a coupling, so that the power of the stirring motor can ...

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Abstract

The present invention belongs to the technical field of silicon wafer processing, and specifically relates to a stirring apparatus of a silicon wafer grinding liquid. The stirring apparatus comprises a stirring barrel provided with a liquid inlet and a liquid outlet, and a stirring mechanism arranged on the stirring barrel and provided for stirring inside the stirring barrel, wherein the stirring mechanism comprises a stirring motor arranged on the stirring barrel, a stirring main shaft connected with the stirring motor output shaft, and a plurality of stirring blades arranged on the stirring main shaft, and the side walls of every stirring blade are provided with concave grooves. The stirring apparatus of the present invention has characteristics of no requirement of manual stirring, labor intensity reducing, uniform stirring and complete meeting of the silicon wafer production requirement.

Description

technical field [0001] The invention belongs to the technical field of silicon wafer processing, and in particular relates to a stirring device for silicon wafer grinding liquid. Background technique [0002] During the processing of silicon wafers, in order to meet the molding requirements of silicon wafers, it is necessary to grind silicon wafers. In the prior art, manual agitation is generally used for the abrasive liquid required for silicon wafer processing. Due to manual agitation, the force is uneven and the agitation is uneven, and it is difficult to meet the molding requirements of silicon wafers, so that the quality of the silicon wafers produced cannot be achieved. Reach the standard; In addition, manual mixing is labor-intensive and the work efficiency is low. Contents of the invention [0003] In view of the above technical problems, the present invention provides a stirring device for silicon wafer grinding liquid that does not require manual stirring, reduc...

Claims

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Application Information

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IPC IPC(8): B01F7/18B01F13/02B01F33/40
Inventor 周建国夏利荣
Owner CHANGZHOU LIWEI KNIFE
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