Electromagnetic oven

Abstract

The invention discloses an electromagnetic oven, relates to the technical field of kitchen cooking, and is designed for solving the problems that the service life of electric elements is influenced as the moisture on the surface of a cooking table is easily sucked, and the heat dissipation effect is poor in a conventional electromagnetic oven. The electromagnetic oven comprises a base and an upper cover assembly which form a furnace chamber, wherein a fan is arranged in the furnace chamber; a fan cover is arranged at the periphery of the fan; an air baffle rib is arranged on the base; a cold air cavity and a heating cavity are formed in the two sides of the fan cover and the air baffle rib respectively; a side air inlet through which cooling air enters the cold air cavity is formed in the side wall of the cold air cavity, and a side air outlet through which the cooling air is discharged from the heating cavity is formed in the side wall of the heating cavity. According to the electromagnetic oven, the cooling air enters the side wall of the cold air cavity, so that the moisture on the surface of the cooking table is hardly sucked, the damage on the electric elements in the electromagnetic oven is avoided, and the service life of the electric elements is prolonged.

Description

technical field [0001] The invention relates to the technical field of kitchen cooking, in particular to an electromagnetic cooker. Background technique [0002] The induction cooker mainly uses the alternating magnetic field generated by the electromagnetic coil for heating. In order to generate the alternating magnetic field, it is necessary to pass high-frequency alternating current into the electromagnetic coil, so switching elements such as IGBT are required to control the current flowing into the electromagnetic coil. . This will cause excessive heat generation of electrical components such as IGBTs and electromagnetic coils, which requires a corresponding heat dissipation structure to be designed on the induction cooker. [0003] At present, the heat dissipation structure of the mainstream induction cooker on the market is as follows: install a fan on the base of the induction cooker, and set air inlets on the bottom wall and side wall of the base. The main air inlet...

AI Technical Summary

Problems solved by technology

This will cause excessive heat generation of electrical components such as IGBTs and electromagnetic coils, which requires a corresponding heat dissipation structure to be designed on the induction cooker

[0003] At present, the heat dissipation structure of the mainstream induction cooker on the market is as follows: install a fan on the base of the induction cooker, and set air inlets on the bottom wall and side wall of the base. The main air inlet is set on the bottom wall of the base directly below the corresponding fan. The structure is easy to absorb the moisture on the cooking surface into the induction cooker, which affects the life of the electrical components inside the induction cooker; in addition, there is only one fan to dissipate heat from the electrical components such as IGBT, bridge stack, and coil plate, which has the problem of poor heat dissipation, and It is difficult to make the induction cooker thin

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