Low-loss, high-stability and high-intermodulation double-frequency 4G combiner

A high-stability, high-intermodulation technology, applied in the field of electronic communication, can solve the problems of large size, difficult processing, complex structure, etc., and achieve the effect of high power capacity, smooth signal transmission, and small size.

Inactive Publication Date: 2014-11-26
董后友
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] After years of development, wireless communication technology has entered the 3G era from the GSM era, and the more advanced 4G network in the future already has a practical technology, and there are also pilot projects in China. The existing types of antennas and transceiver input ports are not Low loss, high intermodulation, and selective combiners still use three-dimensional radiation structures and multi-cavity resonant structures, which are bulky, complex in structure, and difficult to process, which has become a major obstacle to the miniaturization of wireless communication products: the main reason is The radiation conversion space and frequency resonance space on which it is based are free air with an electrolyte constant close to 1 and minimal loss

Method used

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  • Low-loss, high-stability and high-intermodulation double-frequency 4G combiner

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Embodiment Construction

[0010] Such as figure 1 As shown, a low-loss, high-stability, high-intermodulation dual-frequency 4G combiner includes a cavity 1 and a cover plate, and an antenna port N-type connector 2 is installed on the left side of the cavity 1. GSM / DCS port N-type connector 3 and TDA / TDF / LTE port N-type connector 4 are installed on the right side of the body, silver layer 5 is plated on the inner wall of cavity 1, and out-of-band stray Signal control element 6 and a plurality of high-power tuning capacitors 7, the antenna port N-type connector 2, GSM / DCS port N-type connector 3 and TDA / TDF / LTE port N-type connector 4 through the input and output transmission line 8 It is connected with the high-power tuning capacitor 7 inside the cavity 1 .

[0011] The material of the cavity 1 is aluminum; the material of the high-power tuning capacitor 7 is iron; the material of the out-of-band stray signal control element 6 is copper, and the surface is plated with silver.

[0012] The thicknes...

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Abstract

The invention discloses a low-loss, high-stability and high-intermodulation double-frequency 4G combiner. The combiner comprises a cavity and a cover plate, wherein an antenna port N-type connector is installed on the left side of the cavity, a GSM / DCS port N-type connector and a TDA / TDF / LTE port N-type connector are installed on the right side of the cavity, the inner wall of the cavity is plated with a silver layer, an out-of-band spurious signal control element and a plurality of high-power tuning capacitors are installed in the cavity, and the antenna port N-type connector, the GSM / DCS port N-type connector and the TDA / TDF / LTE port N-type connector are connected with the high-power tuning capacitors in the cavity through input transmission lines and output transmission lines. The low-loss, high-stability and high-intermodulation double-frequency 4G combiner has the advantages of being low in loss, high in intermodulation and power capacity, small in external dimension, beautiful in design, smooth in signal transmission, convenient to install and maintain and the like.

Description

technical field [0001] The invention relates to the technical field of electronic communication, in particular to a dual-frequency 4G combiner with low loss, high stability and high intermodulation. Background technique [0002] After years of development, wireless communication technology has entered the 3G era from the GSM era, and the more advanced 4G network in the future already has a practical technology, and there are also pilot projects in China. The existing types of antennas and transceiver input ports are not Low loss, high intermodulation, and selective combiners still use three-dimensional radiation structures and multi-cavity resonant structures, which are bulky, complex in structure, and difficult to process, which has become a major obstacle to the miniaturization of wireless communication products: the main reason is The radiation conversion space and frequency resonance space on which it is based are free air with an electrolyte constant close to 1 and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/213
Inventor 董后友
Owner 董后友
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