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High temperature-resistant low viscosity pressure-sensitive adhesive used for protection films, and preparation method and application thereof

A pressure-sensitive adhesive and protective film technology, applied in the field of pressure-sensitive adhesives, can solve the problems of high temperature resistance and increased peeling force, and achieve the effects of convenient secondary processing, small growth and low peeling strength

Inactive Publication Date: 2014-11-19
ZHANGJIAGANG KANGDE XIN OPTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a high-temperature-resistant and low-viscosity pressure-sensitive adhesive used for protective films and its preparation method and application, so as to overcome the peeling force that exists in the existing pure acrylate pressure-sensitive adhesive. And increase, the problem of not being able to withstand high temperature

Method used

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  • High temperature-resistant low viscosity pressure-sensitive adhesive used for protection films, and preparation method and application thereof
  • High temperature-resistant low viscosity pressure-sensitive adhesive used for protection films, and preparation method and application thereof
  • High temperature-resistant low viscosity pressure-sensitive adhesive used for protection films, and preparation method and application thereof

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preparation example Construction

[0056] A kind of preparation method of the high-temperature-resistant low-viscosity pressure-sensitive adhesive that is used for protective film of the present invention, it comprises the steps:

[0057] S1. Mix the basic monomer and the modified monomer in proportion to form a mixed solution;

[0058] S2. prepare the organic solution of initiator;

[0059] S3. preparing an organic solvent;

[0060] S4. In parts by mass, 1 / 3 of the mixed solution, 1 / 3 of the organic solution of the initiator, and at least 2 / 3 of the organic solvent are added to the reactor for reaction, and then the remaining mixed solution and the initiator are added dropwise Put the organic solution in the reactor, keep it warm after the dropwise addition, when the remaining organic solvent is left, add the remaining organic solvent dropwise in the reactor, after the dropwise addition, cool down and filter the material to obtain the target product.

[0061] In the present invention, silicones with double b...

Embodiment 1

[0076] Mix 70 g of n-butyl acrylate, 22 g of isooctyl acrylate, and 2 g of stearyl methacrylate to prepare basic monomers. Mix 4 g of silicone with double bonds at both ends with a molecular weight of 1000, and 1.9 g of acrylic acid to prepare a modified monomer. Mix the basic monomer and the modified monomer evenly to form a mixed solution.

[0077] 0.2 g of ethyl acetate and 0.1 g of benzoyl peroxide were mixed to prepare an organic solution of the initiator. And 100g of ethyl acetate was used as the organic solvent.

[0078] Add 1 / 3 of the mixed solution, 1 / 3 of the organic solution of the initiator, and all the organic solvents into a four-neck flask equipped with stirring, reflux device, and constant pressure dropping funnel. Raise the temperature to 80°C, and after reacting for 3 hours, add the remaining 2 / 3 of the mixed solution and the remaining 2 / 3 of the organic solution of the initiator dropwise, and control the dropping within 4 hours. After dripping and keeping...

Embodiment 2

[0081] Mix 65 g of n-butyl acrylate, 13 g of isooctyl acrylate, 3 g of stearyl methacrylate, and 8 g of methyl methacrylate to prepare basic monomers. Mix 2 g of silicone with double bonds at both ends with a molecular weight of 5000, and 4 g of acrylic acid to prepare a modified monomer. Mix the basic monomer and the modified monomer evenly to form a mixed solution.

[0082] Mix 2 g of ethyl acetate and 1 g of benzoyl peroxide to prepare an organic solution of the initiator. 100 g of ethyl acetate and 50 g of butyl acetate were mixed as a mixed solvent.

[0083]Add 1 / 3 of the mixed solution, 1 / 3 of the organic solution of the initiator, and all the mixed solvent into a four-neck flask equipped with a stirring, reflux device, and constant pressure dropping funnel. Raise the temperature to 85°C, and after reacting for 3 hours, add the remaining 2 / 3 of the mixed solution and the remaining 2 / 3 of the organic solution of the initiator dropwise, and control the dropping within 6 ...

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Abstract

The invention discloses a high temperature-resistant low viscosity pressure-sensitive adhesive used for protection films, and a preparation method and an application thereof. The preparation method comprises the following steps: 1, providing a basic monomer and a modifying monomer, and mixing the basic monomer with the modifying monomer in proportion to form a mixed solution; 2, preparing an initiator organic solution; 3, preparing an organic solvent; and 4, adding the mixed solution, the initiator organic solution and the organic solvent into a reactor, reacting, adding the residual mixed solution and the residual initiator organic solution into the reactor in a dropwise manner, carrying out heat insulation, adding the residual organic solvent into the reactor if the organic solvent is still residual, cooling after the dropwise addition, and filtering the obtained discharged material to obtain a target product. The pressure-sensitive adhesive has a wide application. The pressure-sensitive adhesive has a very small peeling strength increase in high temperature environment, can be used at a high temperature of 150DEG C, and is convenient for secondary processing. The pressure-sensitive adhesive has low viscosity, and does not stay on a protected surface after peeling.

Description

technical field [0001] The invention relates to a pressure-sensitive adhesive, in particular to a high-temperature-resistant and low-viscosity pressure-sensitive adhesive used for a protective film, a preparation method and application thereof. Background technique [0002] Pressure-sensitive adhesive is an adhesive that is sensitive to pressure, does not require heating, does not require solvents, does not require a lot of pressure, and only needs a small pressure to achieve bonding. Its main feature is easy bonding, easy to uncover, easy to peel off, and the adhesive layer will not dry up for a long time, so pressure-sensitive adhesive is also called self-adhesive. Most of the pressure-sensitive adhesives are made into various pressure-sensitive adhesive products such as adhesive tapes and films, which are sold and applied. Pressure-sensitive adhesive products have functions such as bonding, binding, fixing, protection, decoration, insulation and identification, and are m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C08F220/18C08F230/08C08F220/06C08F220/14C08F218/08C08F222/14C08F220/28
Inventor 高山李洁
Owner ZHANGJIAGANG KANGDE XIN OPTRONICS MATERIAL
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