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Polyimide film and preparation methods thereof

A technology of polyimide film and polyimide resin, which is applied in the field of polyimide, can solve the problems of colorless and transparent polyimide film popularization and use, poor film mechanical properties, and difficulty in dianhydride synthesis. Achieve high visible light transmittance, low curing temperature, excellent thermal and mechanical properties

Active Publication Date: 2014-11-19
长春聚明光电材料有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The mechanical properties of the above-mentioned films prepared from dianhydrides with alicyclic structure are poor, and the synthesis of dianhydrides is difficult, the production process is complicated, and the cost is high
However, fluorine-containing substituents or side groups are introduced into the dianhydride, such as 4,4'-(hexafluoroisopropylene) diphthalic anhydride (6FDA), and the film prepared by using this dianhydride has excellent properties, but there are still two Anhydrides are expensive and other problems, which have caused certain difficulties to the popularization and use of colorless and transparent polyimide films

Method used

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  • Polyimide film and preparation methods thereof
  • Polyimide film and preparation methods thereof
  • Polyimide film and preparation methods thereof

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preparation example Construction

[0063] Correspondingly, the invention provides a kind of preparation method of polyimide film, comprises the following steps:

[0064] 1A) reacting diphenyl sulfide dianhydride and para-aromatic diamine in the first organic solvent to obtain a polyimide solution; the diphenyl sulfide dianhydride includes 3,4,3',4'- One or more of diphenyl sulfide dianhydride, 2,3,2',3'-diphenyl sulfide dianhydride, 2,3,3',4'-diphenyl sulfide dianhydride, said Aromatic diamines include 2,2'-bistrifluoromethyl-4,4'diaminobiphenyl;

[0065] 1B) Precipitating the polyimide solution to obtain a polyimide resin;

[0066] 1C) mixing the polyimide resin, a release agent and a second organic solvent to obtain a polyimide resin solution;

[0067] 1D) Casting the polyimide resin solution to form a film to obtain a polyimide film.

[0068] In this application, diphenyl sulfide dianhydride is used as a dianhydride monomer, and 2,2'-bistrifluoromethyl-4,4'-diaminobiphenyl is used as a diamine monomer to ...

Embodiment 1

[0120] In the presence of nitrogen and stirring, 10.4119g of 2,2'-bistrifluoromethyl-4,4'-diaminobiphenyl was dissolved in 105g of phenol, and after complete dissolution, 10.6076g of 3,4 , 3',4'-diphenyl sulfide dianhydride, heated to 180 ° C for reaction, stirred for 30 hours to generate a polyimide solution.

[0121] The polyimide solution was gradually added into the ethanol under high-speed stirring to obtain a white silk flocculent polyimide resin.

[0122] The white silk flocculent polyimide resin was washed, and then dried at 100° C. for 8 hours to obtain 17.61 g of dried white silk flocculent polyimide resin. 100 g of dimethylacetamide was used to dissolve 17.61 g of the dried white flocculent polyimide resin, and then 0.06 mL of triphenyl phosphite was added with a pipette, and stirred for 8 hours to obtain a polyimide resin solution.

[0123] After the obtained polyimide resin solution was filtered and vacuum defoamed for 3 hours, it was cast on a glass plate to for...

Embodiment 2

[0128] In the presence of nitrogen and stirring, 10.4728g of 2,2'-bistrifluoromethyl-4,4'-diaminobiphenyl was dissolved with 120g of m-cresol, and after it was completely dissolved, 1.0670g of 2 ,3,2',3'-diphenyl sulfide dianhydride, 5.3348g 3,4,3',4'-diphenyl sulfide dianhydride and 4.2679g 2,3,3',4'-diphenyl sulfide Dianhydride, heated to 120°C for reaction, stirred for 30 hours to generate polyimide glue.

[0129] The obtained polyimide solution was gradually added into ethanol under high-speed stirring to obtain a white silk flocculent polyimide resin.

[0130] The white silk floc polyimide resin was washed, and then dried at 100° C. for 8 hours to obtain 17 g of dried white silk floc polyimide resin. Dissolve 17 g of the dried white flocculent polyimide resin with 97 g of dimethylacetamide, then add 0.07 mL of triphenyl phosphite with a pipette, and stir for 8 hours to obtain a polyimide resin solution.

[0131] After the obtained polyimide resin solution was filtered a...

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Abstract

The invention provides a polyimide film which is prepared from a polymer of a first repeating unit shown as formula I. The invention further provides two preparation methods of the polyimide film. In the preparation methods, the polyimide film is synthesized and prepared by taking diphenyl sulfide dianhydride as a dianhydride monomer and 2,2'-bis-trifluoromethyl-4,4'-diamino biphenyl as a diamine monomer, wherein the diphenyl sulfide dianhydride is relatively weak in electronegativity of a thioether bond and relatively weak in electron absorbance and can bend a main chain of the polymer, so that the diphenyl sulfide dianhydride has the function of reducing formation of a charge transfer complex in a polyimide molecule; a trifluoromethyl substituent is introduced at a 2,2'-position of the 2,2'-bis-trifluoromethyl-4,4'-diamino biphenyl to generate a non-coplanar structure, so that a conjugated unit can be weakened. The two monomers are easy to synthesize and relatively low in cost, so that the polyimide film is relatively high in visible light transmittance, excellent in thermal and mechanical properties and low in production cost.

Description

technical field [0001] The present application relates to the technical field of polyimide, in particular to a polyimide film and a preparation method thereof. Background technique [0002] Due to its excellent physical and chemical properties, polyimide can be used as structural composite materials, electrical insulation materials and coating materials, and is widely used in aerospace, microelectronics and optical devices and other fields. Especially in the fields of microelectronics and optical devices, the application of polyimide is more prominent. For example, polyimide can be used as a protective layer to reduce environmental damage to electronic devices, and can also be used as a dielectric layer for device insulation , can also serve as flexible circuit board substrate material and liquid crystal alignment film, etc. In recent years, the flexible technology in the field of optoelectronics has developed rapidly. For polyimide, the birth of colorless and transparent p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08J5/18C08G73/10
CPCC08G73/1007C08G73/1067C08G73/1071C08J5/18C08J2379/08C08L79/08
Inventor 付饶刘洋张海洋许杨靳野郭百灵
Owner 长春聚明光电材料有限公司
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