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High-density interconnection integrated circuit board manufacturing method

An integrated circuit board, high-density interconnection technology, applied in the directions of printed circuit manufacturing, printed circuit, printed circuit secondary processing, etc., can solve the problems of many production process links, high production cost, insufficient safety and reliability, etc. Achieve the effect of enhancing electroplating uniformity, improving production efficiency and production quality, and improving reliability and safety

Active Publication Date: 2014-11-12
四川深北电路科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are many deficiencies in the current production of high-density interconnected integrated circuit boards, such as low production efficiency, insufficient safety and reliability, too many production process links, long processing cycle, and high production costs, etc.

Method used

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  • High-density interconnection integrated circuit board manufacturing method

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Embodiment Construction

[0018] Further describe the technical scheme of the present invention in detail below in conjunction with accompanying drawing:

[0019] Such as figure 1 Shown, a kind of high-density interconnection integrated circuit board fabrication method, it comprises the following steps:

[0020] S1: Use a UV laser drill to drill through holes in the product area on the circuit board according to the design requirements, and drill test holes in the edge area of ​​the board outside the product area;

[0021] S2: Use ordinary electroplating and micro-hole electroplating technology to form a copper clad layer on the plate surface, the wall of the via hole and the wall of the test hole, and fill the via hole and the test hole with resin after copper cladding;

[0022] S3: Carry out sinking copper treatment to plate;

[0023] S4: Use ultrasonic technology to remove slag from the board.

[0024] The stated test hole diameter is the same as the smallest via hole diameter in the product area...

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Abstract

The invention discloses a high-density interconnection integrated circuit board manufacturing method which comprises the following steps that S1, a UV laser drilling machine is used to drill a via hole in the product area on a circuit board according to the design requirement, and a test hole is drilled in the board edge area outside the board product area; S2, a copper covering layer is formed on the board surface, the via hole wall and the test hole wall through a common electroplate drawing micropore electroplate technology, and the via hole and the test hole are filled with resin after copper covering is conducted; S3, electroless plating copper treatment is conducted on the board; S4, desmear treatment is conducted on the board through an ultrasonic technology. The high-density interconnection integrated circuit board manufacturing method is high in safety and reliability and high in production efficiency.

Description

technical field [0001] The invention relates to a method for manufacturing a high-density interconnection integrated circuit board. Background technique [0002] A high-density printed circuit board is a structural component formed of insulating materials supplemented by conductor wiring. When the final product is made, integrated circuits, transistors, diodes, passive components (such as: resistors, capacitors, connectors, etc.) and various other electronic components will be installed on it. Through the connection of wires, electronic signal connection and corresponding functions can be formed. Therefore, the printed circuit board is a platform that provides component connections and is used to undertake the basis for connecting parts. [0003] In order to avoid confusion, the IPC Circuit Board Association of the United States proposed to call this type of product the general name of HDI (High Density Intrerconnection Technology). If it is directly translated, it will be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42H05K3/26
Inventor 黄国建
Owner 四川深北电路科技有限公司
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