A contact thermal resistance detection device under micro-stress conditions

A technology of contact thermal resistance and detection device, applied in the direction of thermal development of materials, can solve the problems of inability to realize the micro-stress contact thermal resistance, the effect of contact stress cannot be eliminated, etc., and achieve the effect of overcoming the influence of friction and accurate detection results.

Active Publication Date: 2016-06-08
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the problem that the traditional contact thermal resistance detection device can only detect the heat transfer of the tested part under relatively large stress, it cannot realize the contact thermal resistance under micro-stress or no stress state, and at the same time, there is a contact resistance caused by the self-weight of the material itself. The problem that stress cannot be eliminated, a contact thermal resistance detection device under micro-stress conditions is proposed

Method used

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  • A contact thermal resistance detection device under micro-stress conditions
  • A contact thermal resistance detection device under micro-stress conditions
  • A contact thermal resistance detection device under micro-stress conditions

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specific Embodiment approach 1

[0020] Specific implementation mode 1. Combination Figure 1-Figure 4 Describe this specific embodiment. A contact thermal resistance detection device under micro-stress conditions described in this specific embodiment includes a vacuum cover 3, a cooling plate 6, a right fixed plate 9, a left fixed plate 19, a support frame 16, and a lifting platform 12 , heating plate 20, screw rod 21, spring 11, nut 22 and insulation plate 23, the inside of described vacuum cover 3 is a vacuum cavity, cooling plate 6, right fixed plate 9, left fixed plate 19, support frame 16, lifting platform 12. The heating plate 20, the screw rod 21 and the spring 11 are all located inside the vacuum chamber, the lift table 12 is fixed on the bottom of the vacuum cover 3, the top of the lift table 12 is placed to be tested, the right fixed plate 9 and the support frame 16 Located on both sides of the lifting platform 12, the right fixed plate 9 and the support frame 16 are all fixed on the bottom of the ...

specific Embodiment approach 2

[0023] Specific embodiment two, combine figure 1 Describe this specific embodiment. The difference between this specific embodiment and the contact thermal resistance detection device under micro-stress conditions described in the first specific embodiment is that it also includes a heat insulating element 17, and the heat insulating element 17 is fixed on the left Between the fixed plate 19 and the support frame 16.

[0024] In this embodiment, the left fixing plate 19 and the support frame 16 are separated by the heat insulating element 17, so that the heat in the heating plate 20 will not be transferred to the vacuum cover 3 through the support frame 16, so that the heat can be concentrated and the detection is improved. precision.

specific Embodiment approach 3

[0025] Specific embodiment three, combine figure 1 Describe this specific embodiment, the difference between this specific embodiment and the contact thermal resistance detection device under micro-stress conditions described in specific embodiment 1 is that it includes a backing plate, a vent pipe 9 and an air pump 8, and the backing plate is fixed On the top of the lifting platform 12, there is an air cavity inside the backing plate, and a plurality of through holes are opened on the top of the backing plate, and the plurality of through holes are all communicated with the air cavity. The air cavity inside the board communicates.

[0026] In this embodiment, when testing the contact thermal resistance of the tested piece, the air between the lifting table 12 and the tested piece is discharged by the air pump 8, thereby overcoming the influence of friction and making the testing result more accurate.

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Abstract

The invention relates to a contact thermal resistance detection device under micro-stress conditions, which relates to the technical field of contact thermal resistance detection. It solves the problem that the traditional contact thermal resistance detection device can only detect the heat transfer of the tested part under relatively large stress, and cannot realize the contact thermal resistance under micro stress or no stress state. At the same time, there is a contact stress effect caused by the material's own weight. problems that cannot be eliminated. The detection device of the present invention makes the left fixing plate and the right fixing plate clamp the measured piece through the cooperation of the screw rod and the nut, and controls the elongation of the spring through the nut, so as to realize the micro-stress loading of the tested piece. There are scales, so the elongation of the screw can be determined, and then the prestress between the tested parts can be determined. At the same time, the tested parts are supported by the lifting table; The heat in the plate will not be transferred to the vacuum cover through the support frame, so that the heat can be concentrated and the detection accuracy can be improved. The invention is suitable for detecting contact thermal resistance.

Description

technical field [0001] The invention relates to the technical field of contact thermal resistance detection. Background technique [0002] The contact thermal resistance of the joint surface is one of the important characteristic parameters of the joint surface, and its accuracy will directly affect the characteristic model of the joint surface parameters. In high-precision optical systems such as lasers, the material will be deformed due to high contact stress, which will affect the optical accuracy. , so in this kind of optical system, there are widely micro-stress contact interfaces, and under different pre-tightening forces, it will greatly affect the heat transfer between materials. Contact thermal resistance plays a crucial role in the design calculations of optical components. The traditional measurement method can only detect the heat transfer of the tested part under relatively large stress, and cannot realize the contact thermal resistance under micro stress or no...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20
Inventor 张鹏孙付仲卢礼华梁迎春
Owner HARBIN INST OF TECH
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