Zn-Sn composite coating bundling belt for bundling precision electronic component and production method thereof

Abstract

Disclosed is a Zn-Sn composite coating bundling belt for bundling a precision electronic component. The Zn-Sn composite coating bundling belt comprises, by weight, C ranging from 0.05 percent to 0.10 percent, Mn ranging from 0.30 percent to 1.00 percent, Si smaller than or equal to 0.010 percent, P smaller than or equal to 0.010 percent, S smaller than or equal to 0.010 percent, Nb ranging from 0.030 percent to 0.060 percent, V ranging from 0.040 percent to 0.070 percent and Als ranging from 0.050 percent to 0.080 percent. A production method comprises the steps of smelting and continuous casting to form a blank, conventional casing blank heating, hot rolling, conventional pickling, cold rolling, conventional degreasing and belt manufacturing. The thickness of the product is 0.5 mm, the tensile strength is not smaller than 1000MPa, the extending rate is not smaller than 10 percent, the time of alternating bending is not smaller than eight (R is equal to 5mm), a Zn-Sn composite coating is generated on the surface of the belt, the coating is even and compact, and strong in adhesive force, the thickness of the coating is three micrometers to four micrometers, the coating has the beautiful luster appearance, and when the belt is placed in the indoor atmospheric environment, the service life of the belt is prolonged to be 510 days and the belt is not obviously corroded compared with a blue and painted bundling belt with the corrosion resistance time not exceeding two months to the highest. The bundling belt completely meets the requirement of the precision electronic component for bundling and packaging, the surface hardness of the bundling belt is low, the bundling belt is relatively soft, and the damage to the precision electronic component hardly exists.

Description

technical field [0001] The invention relates to a strap and a production method thereof, in particular to a Zn-Sn composite coating strap for bundling precision electronic components and a production method thereof. Background technique [0002] Due to their light weight and high surface accuracy, precision electronic components require special attention when bundling and storing them. At present, blued and painted straps are generally used. Due to the high surface roughness and poor corrosion resistance of the blued and painted straps, the straps are easy to damage the surface of the packaged objects in the bundle, resulting in unqualified, and easy to cause broken straps, resulting in scattering and damage to precision electronic components; and The low-grade packaging concept makes it difficult to meet the development needs of the packaging market. [0003] Searched: [0004] The Chinese patent application number 201410078127.5 discloses a hot-dip galvanized strap with...

AI Technical Summary

Problems solved by technology

However, since electroplating Zn is generally carried out at 20-30 °C, and hot-plating Sn is generally carried out at 320-380 °C, the temperature is not very high, and the room for adjusting the mechanical properties of the product through the process is limited.

Therefore, product performance may be affected to some extent

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