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Flux composition and solder composition

A composition and flux technology, applied in the field of flux compositions and solder compositions, can solve the problems of discoloration of the flux, the meltability of the solder composition may not be sufficient, etc., to prevent the discoloration of copper foil, and to achieve excellent solder coating expansion. , the effect of excellent solder melting

Active Publication Date: 2014-10-01
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, it has been found that when soldering is performed using the solder compositions described in Documents 1 and 2, there is a problem of discoloration of the copper foil after soldering and the portion where flux remains around the solder to green or black.
In addition, the solder compositions described in the aforementioned Documents 1 and 2 are still not necessarily sufficient in terms of solder meltability.

Method used

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  • Flux composition and solder composition
  • Flux composition and solder composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Rosin resin A43 mass %, rosin resin B6 mass %, organic acid A3.5 mass %, iodine carboxyl compound A0.2 mass %, antioxidant 2 mass %, thixotropic agent A4 mass %, thixotropic agent B4 mass %, 0.3 mass % of a nitrogen-containing compound, and 37 mass % of a solvent were put into a container, respectively, and mixed using a grinder, and flux was obtained.

[0072] Then, 11% by mass of the obtained flux composition and 89% by mass of solder powder were put into a container, and mixed with a kneader for 2 hours to prepare a solder composition having a composition shown in Table 1 below.

Embodiment 2～11

[0074] A flux composition and a solder composition were obtained in the same manner as in Example 1 except that each material was blended according to the composition shown in Table 1.

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PUM

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Abstract

The invention provides a flux composition and a solder composition using the same. The flux composition contains resin and an active agent, wherein the active agent contains iodine-class carboxyl compounds.

Description

technical field [0001] The present invention relates to a flux composition and a solder composition using the flux composition. Background technique [0002] The solder composition (solder paste) is a paste-like mixture obtained by kneading a flux composition (rosin-based resin, activator, solvent, etc.) and solder powder. Printability and solder meltability are required for this solder composition, and properties such as easy spread of solder (solder spread) are also required. Therefore, a solder composition containing, as an activator in a flux composition, a halogen-containing activator excellent in solder spread and solder meltability is used. As the halogen-based activator, various components have been studied, and for example, ammonium halide compounds containing halogen atoms such as fluorine, chlorine, and bromine have been proposed (for example, Document 1: JP-A-3-180296). Also, a halogenated organic acid containing a halogen atom such as fluorine, chlorine, or br...

Claims

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Application Information

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IPC IPC(8): B23K35/363B23K35/24
CPCB23K35/3618B23K35/362B23K35/0266B23K35/3613C08K5/09H01L2924/01028H01L2924/01029H01L2924/0103H01L2924/01032H01L2924/01047H01L2924/01049H01L2924/0105H01L2924/01051H01L2924/01079H01L2924/01083
Inventor 中野健原岛启太山下宣宏
Owner TAMURA KK
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