Universal vibration threshold-value sensor and 3D printing preparation method for same

Abstract

The invention provides a universal vibration threshold-value sensor and a 3D printing preparation method for the same. According to the universal vibration threshold-value sensor, a hemispherical movable mass block electrode is connected with one end of a snakelike spring; the other end of the spring is connected with spring support columns and the movable mass block electrode is suspended above a fixed electrode; the spring support columns are arranged on the edge of an insulation substrate and uniformly distributed around the movable mass block electrode; the fixed electrode is fixed on the insulation substrate; a certain distance exists between the hemispherical recession of the fixed electrode and the movable mass block electrode; the electrode gap between the fixed electrode and the movable mass block electrode presents a hemispherical channel; after external vibration achieves a threshold value, the two electrodes are connected, and the sensitivity of a plurality of directions is realized; all the devices are composed of 3D-printed conductive metal structures except the insulation substrate. The accelerated speed impact response sensitivity of the vibration threshold-value sensor disclosed by the invention for a Z-direction and all directions in a hemispherical surface is realized.

Description

technical field [0001] The present invention designs a vibration threshold sensor device in the technical field of micro-electromechanical systems (MEMS), specifically a universal vibration threshold sensor and a method for preparing the sensor by 3D printing. Background technique [0002] Miniature vibration threshold sensor (also known as inertial switch or acceleration threshold sensor), as a new type of passive device, is widely used in various microelectronic systems because of its advantages of small size and light weight, especially with the With the development of networking systems, various sensor devices are combined with the Internet to form a wireless sensor network system, and these sensors are often placed in remote environments or implanted inside objects due to certain special needs, resulting in difficulties in power supply. Compared with accelerometers and gyroscopes, vibration threshold sensors do not need to maintain a stable current under normal conditio...

AI Technical Summary

Problems solved by technology

In the actual environment, it is difficult to ensure that the shock comes from the specified direction, so it is required to have a multi-directional sensitive MEMS vibration threshold sensor

In order to meet the demand for multi-directional sensitivity, in the existing solutions, it is often necessary to combine multiple unidirectional sensitive vibration threshold sensors, which not only increases the overall size of the system, makes it difficult to coincide with the center of mass, but also has low measurement accuracy , poor reliability, therefore, the industry has an urgent demand for multi-directional vibration threshold sensors

[0004] Silicon-based etching or electroplating based on micromachining technology, the prepared vibration threshold sensor is a rigid collision between two electrodes, which is easy to cause damage to the device, and more importantly, the rigid collision between electrodes The contact time is shortened, and the collision is easy to rebound, which brings difficulties to the later signal processing while reducing the stability of the device

After retrieving the existing technical literature, it was found that Luke J.Currano et al published a paper entitled "Triaxial inertial switch with multiplethresholds and Resistive ladder readout" ("Three-axis multi-threshold inertia switch with stepped resistance output") proposed a multi-threshold sensor that can be sensitive to multiple directions in the X, Y, and Z axes, so that the vibration threshold sensor Research is no longer only sensitive to one direction. Although this multi-threshold vibration sensor solves the problem of a single sensitive direction of the sensor, it can realize acceleration sensitivity in multiple axes and multiple threshold sensitivity. However, due to the limitations of MEMS surface micromachining technology , usually can only form a three-dimensional structure layer by layer by traditional semiconductor planar processes such as lithography and etching, and it is impossible to truly realize the processing of sensor devices with complete three-dimensional arbitrary shape structures, so it is impossible to realize the sensor in three-dimensional space. Sensitive to direction

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