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Display substrate, manufacturing method of display substrate and display device

A technology for a display substrate and a manufacturing method, which is applied in the manufacturing of semiconductor/solid-state devices, instruments, semiconductor devices, etc., can solve the problems of stress accumulation in the electrode layer and disconnection of the electrode layer, and achieve the effect of avoiding disconnection.

Inactive Publication Date: 2014-09-10
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] To sum up, in the prior art, due to the high height of the spacer and the long straight sides, the electrode layer above the spacer has a phenomenon of stress accumulation, which leads to the electrode layer on the spacer layer disconnection

Method used

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  • Display substrate, manufacturing method of display substrate and display device
  • Display substrate, manufacturing method of display substrate and display device
  • Display substrate, manufacturing method of display substrate and display device

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Embodiment Construction

[0038] In order for those skilled in the art to better understand the technical solution of the present invention, the display substrate provided by the present invention, its manufacturing method, and the display device are described in detail below with reference to the accompanying drawings.

[0039] figure 2 A schematic structural diagram of a display substrate provided in Embodiment 1 of the present invention, as shown in figure 2 As shown, the display substrate includes: a base substrate, a spacer 1 located above the base substrate, and an electrode layer 2 located above the spacer 1 , and the spacer 1 includes at least two layers of stepped structures.

[0040] In this embodiment, the spacer 1 is described as an example including a three-layer stepped structure, and the spacer 1 includes a stepped structure 11 , a stepped structure 12 and a stepped structure 13 . The stepped structure 11 , the stepped structure 12 and the stepped structure 13 are stacked. Specificall...

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Abstract

The invention discloses a display substrate, a manufacturing method of the display substrate and a display device. The display substrate comprises a substrate base plate, a photo spacer placed on the upper portion of the substrate base plate, and an electrode layer placed on the upper portion of the photo spacer. The photo spacer comprises at least two layers of stepped structures. According to the technical scheme of the display substrate, the manufacturing method of the display substrate and the display device, the photo spacer comprises at least two layers of stepped structures, so that the stress concentrated on the electrode layer placed on the upper portion of the photo spacer is effectively dispersed, and therefore the wire breaking phenomenon of the electrode layer placed on the upper portion of the photo spacer is avoided.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] With the development of display technology, large-size display devices are more and more widely used, wherein the large-size display devices may include: large-size liquid crystal displays (Liquid Crystal Display, LCD for short) and active matrix organic light-emitting diodes ( Active Matrix / OrganicLight Emitting Diode, referred to as: AMOLED) panel. Due to the problem of the limit thickness of the packaging box thickness (Cell Gap) in the large-size display device, in the structure of the large-size display device, it is necessary to form a higher spacer (PhotoSpacer, Cell Gap) to ensure the thickness of the display device. Abbreviation: PS), usually the thickness of the spacer reaches more than 10 μm. And it is necessary to form an electrode layer on the spacer. [0003]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1339G02F1/1333H01L27/12H01L21/84
CPCG02F1/1339
Inventor 张立刘兴东王灿
Owner BOE TECH GRP CO LTD
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