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Organic silicon pouring sealant with thixotropy

A technology of silicone potting glue and thixotropy, which is applied in the direction of adhesives, adhesive additives, and other chemical processes, can solve the problems of poor adhesion and other problems, and achieve extended life, good thermal conductivity, flame retardancy, and energy saving. The effect of craft

Inactive Publication Date: 2014-09-10
SHANGHAI HUITIAN NEW CHEMICAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The general condensation type has poor adhesion to components and potting chambers, and volatile low molecular substances will be produced during the curing process, and there will be obvious shrinkage after curing.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] A thixotropic silicone potting compound, two-component A and B, mixed at room temperature, low-viscosity potting, wherein:

[0044] The A component is composed of vinyl silicone oil, diluent, thermally conductive filler, flame retardant filler, catalyst, and each component is calculated by weight:

[0045] The viscosity range is 100-10000cs liquid silicone rubber 100

[0046] Thinner 0~50

[0047] Thermally conductive filler 0~70

[0048] Flame retardant filler 0~30

[0049] Catalyst 0~5

[0050] The catalyst is one of platinum-vinylsiloxane complexes and chloroplatinic acid;

[0051] The B component is composed of vinyl silicone rubber, diluent, thermally conductive filler, flame retardant filler, crosslinking agent, thixotropic agent, inhibitor, and each component is calculated by weight:

[0052] The viscosity range is 100-10000cs liquid silicone rubber 100

[0053] Thinner 0~50

[0054] Thermally conductive filler 0~70

[0055] Flame retardant filler 0~30

...

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PUM

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Abstract

The invention relates to an organic silicon pouring sealant, and in particular relates to the organic silicon pouring sealant for insulation, moisture prevention, heat conduction and flame retardance of electronic and electrical appliances. The pouring sealant has the effects of performing insulation protection on each electronic component, rapidly conducting out work heat to prolong the service life, has rapid thixotropic property after being mixed, and is especially suitable for the occasions that to-be-sealed appliances have micro gaps.

Description

technical field [0001] The invention relates to a potting material, in particular to a thixotropic silicone potting glue. Used for moisture-proof insulation of electronic components. For electronic components and assemblies that require dust-proof, moisture-proof, shock-proof and insulation protection, as well as gaps, the potting compound is required to have a special process of mixing thixotropy. Background technique [0002] Silicone potting glue refers to a type of electronic potting glue made of silicone rubber, including one-component silicone potting glue and two-component silicone potting glue. Silicone potting compounds are generally soft elastomers. [0003] With the development of science and technology, electronic components tend to be miniaturized and dense. In order to prevent the intrusion of moisture, dust and pollutants to electronic components, prevent erroneous damage and stabilize parameters, and minimize the adverse effects of the outside world, it is ...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/04C09K3/10
Inventor 朱仙娥何秀冲赵勇刚
Owner SHANGHAI HUITIAN NEW CHEMICAL MATERIALS CO LTD
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