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Insulation board for building exterior

A technology for thermal insulation boards and building walls, which is applied in the direction of construction, building structure, layered products, etc. It can solve the problems of insulation board sound insulation and unsatisfactory thermal insulation effect, so as to reduce the probability of spawning and reproduction, reduce the breeding rate, and sound insulation Excellent effect

Active Publication Date: 2016-08-17
赵国平
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 3. The sound insulation and thermal insulation effect of the thermal insulation board in the prior art is not ideal, and further improvement is needed

Method used

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  • Insulation board for building exterior

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Embodiment Construction

[0012] In order for those skilled in the art to further understand the features and technical content of the present invention, please refer to the following detailed description of the present invention.

[0013] The invention provides a thermal insulation board for building walls, wherein the thermal insulation board includes a cement board decorative layer on the outer layer, a cement board base layer for connecting the building wall, and a cement board decorative layer connected to the cement board decorative layer and the The sound-insulating and heat-insulating middle layer between the cement board base layers, the cement board decorative layer is composed of the following components in parts by weight: 95 parts of cement, 4 parts of sarcocarpus powder and 1 part of Phalaenopsis petal powder.

[0014] Wherein, the manufacturing method of the decorative layer of the cement board is very simple, only need to mix the cement, the powder of the sarcocarpus and the powder of th...

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Abstract

The invention discloses an external thermal insulation board for a building wall. The thermal insulation board comprises a cement plate decorative layer which is arranged on an external layer, a cement plate base layer which is used for connecting the building wall and a sound-proof thermal insulation interlayer which is connected between the cement plate decorative layer and the cement plate base layer; the cement plate decorative layer is formed by the following components which comprise 95 parts of cement, 4 parts of lepiota brunneo-incarnata powder and one part of butterfly orchid petal powder. The thermal insulation board has the advantages of effectively reducing egg reproduction probabilities of worm, moths and the like at the position of the thermal insulation board, greatly reducing the worm breeding rate, effectively avoiding bird excrement polluting buildings due to the facts that the lepiota brunneo-incarnata powder is added to the cement plate decorative layer and birds hardly stay at building tops and at the modeling design position and being good in sound proof effect and good in thermal insulation effect due to the sound proof thermal insulation interlayer.

Description

technical field [0001] The invention relates to a thermal insulation board used outside building walls. Background technique [0002] There are following defects in the thermal insulation board used outside the building wall in the prior art: [0003] 1. As time goes by, insects and centipedes are easy to breed in the insulation board, which is very unhygienic, and they will crawl into the house of the residents, causing certain troubles; [0004] 2. Especially on the roof or where there is a design on the building, birds often inhabit and discharge feces on the roof or shape; [0005] 3. The sound insulation and thermal insulation effects of the thermal insulation board in the prior art are not ideal, and further improvement is needed. Contents of the invention [0006] In view of this, the technical problem to be solved by the present invention is to provide a thermal insulation board for external use of building walls that is not easy to breed insects and can greatly ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B13/04E04F13/075C04B28/14C04B16/02C04B22/12C04B22/10
Inventor 赵国平
Owner 赵国平
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