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Bottom separation plate microsensor capable of being used for measuring wall shear stress in high temperature environment and manufacturing method thereof

A micro-sensor and high-temperature environment technology, applied in the field of sensors, can solve problems such as the impact of the force conduction performance of the actuating diaphragm and microspheres, and the damage of the internal structure of the sensor, so as to achieve the effect of improving work reliability and reducing failure problems

Active Publication Date: 2014-07-30
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If the sensor is in the high-temperature environment of the intake port and the cold flow of the combustion chamber, the force conduction performance of the actuating diaphragm and the microsphe

Method used

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  • Bottom separation plate microsensor capable of being used for measuring wall shear stress in high temperature environment and manufacturing method thereof
  • Bottom separation plate microsensor capable of being used for measuring wall shear stress in high temperature environment and manufacturing method thereof
  • Bottom separation plate microsensor capable of being used for measuring wall shear stress in high temperature environment and manufacturing method thereof

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Embodiment

[0033] refer to figure 1 , figure 2 , the present invention includes a U-shaped ring 1, a protruding partition 2, a cantilever beam 3, a beam root 4, a U-shaped ring groove 5, a force sensitive resistor 6, a substrate 7, a wire 8 and a pad 9; the protruding partition The plate 2 is supported on the base 7 by two cantilever beams 3 and their beam roots 4; the protruding partition 2 is perpendicular to the incoming flow direction, and part of the protruding partition 2 protrudes from the wall surface of the flow field to be measured; the base 7, the convex The material of the partition plate 2, the cantilever beam 3, and the beam root 4 is the base layer silicon of the SOI silicon wafer; and the silicon material surface of the substrate 7 is deposited with a silicon dioxide layer and a silicon nitride layer;

[0034] The force sensitive resistor 6 is placed on the surface of the beam root 4 at the lowermost end of the cantilever beam 3 through an insulating material;

[0035] A...

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Abstract

The invention discloses a bottom separation plate microsensor capable of being used for measuring wall shear stress in a high temperature environment and a manufacturing method of the bottom separation plate microsensor, and belongs to the technical field of sensors. The microsensor mainly comprises a protruding separation plate 2, cantilever beams 3, beam roots 4, a U-shaped annular groove 5, force-sensitive resistors 6, a substrate 7, wires 8 and bonding pads 9. The bottom separation plate microsensor is made of SOI silicon wafers with the thickness of a device layer smaller than one micron, the sensitive resistors of the microsensor are manufactured on an insulation layer, the resistors are kept independent from one another and are connected through high temperature resisting metal films, the problem that the sensitive resistors and metal leads are out of effect due to high temperature can be effectively solved, and the wall shear stress in the cold flow high temperature environment such as an engine air inlet channel and a combustion chamber can be measured. The measuring range of the microsensor is not limited by the thickness of the device layer of the SOI silicon wafers. The process is simplified, and the difficulty level is lowered. The output consistency of the microsensor is high when the cantilever sensitive beams carry out forward and reverse bending, and high structural robustness is achieved.

Description

[0001] 1. Fields: [0002] The invention belongs to the technical field of sensors, and in particular relates to a bottom partition microsensor which can be used for wall shear stress measurement under high temperature and a manufacturing method thereof. 2. Background technology: [0003] The flow parameters near the wall, especially the wall shear stress, are important parameters for studying and judging the shape of the flow field and the state of the boundary layer. With the continuous development of the national defense industry, higher and higher requirements are put forward for the study of the flow field of the intake port and combustion chamber of the detonation engine, rocket ramjet, etc. under the harsh working environment of cold flow and high temperature. Nowadays, the study of wall shear stress in such environments still relies on numerical simulation analysis, and the corresponding wall shear stress sensor has not yet appeared. [0004] The wall shear stress sen...

Claims

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Application Information

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IPC IPC(8): G01L1/20B81C1/00
Inventor 马炳和马骋宇邓进军
Owner NORTHWESTERN POLYTECHNICAL UNIV
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