High-power semiconductor laser beam combining method

A laser beam combining and semiconductor technology, applied in the field of laser applications, can solve the problems of limited application fields, inability to apply lasers, and large loss of light energy, and achieve the effect of being beneficial to application, low cost, and low loss of light energy

Active Publication Date: 2014-07-23
FOCUSLIGHT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the polarization degree of the laser light source of a semiconductor laser is about 90%, for example, the polarized light emitted by a semiconductor laser with a polarization state of TE generally contains 90% of TE polarized light and 10% of TM polarized light, so if polarization combining is used, the light energy The loss is large, and it is only suitable for beam combining in the direction of the fast axis, and the output light is mixed polarized light, which cannot be combined with other light sources again; when using a semiconductor laser array as a light source, the output spot still remains between bar and bar The luminous dead zone between, the uniformity is poor
Wavelength beam combining is the combination of laser beams of different wavelengths, but it cannot be applied in the occasion where the laser has a single wavelength, which makes it limited in the application field

Method used

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Embodiment 1

[0057] Figure 2aIt is a schematic diagram of the optical path of a high-power semiconductor laser beam combiner combined with the method of the present invention. A high-power semiconductor laser beam combining device includes a semiconductor laser stack 1, a collimating lens group 10, and a beam combining system 6 arranged sequentially along the optical path. The semiconductor laser stack 1 is composed of 4 groups of semiconductor laser unit stacks. The combining Beam system 6 comprises a reflective spacer film layer mirror 4 and a total reflection mirror 5, and described reflective spacer film layer mirror 4 is to plate reflective film at intervals on the lower surface of flat lens, and the quantity of reflective film is 2, and the spacing of reflective film and The width of itself is equal; the reflective spacer film layer mirror 4 and the total reflection mirror 5 are placed between the light emitting direction of the semiconductor laser stack 1 at 45°, and correspond to ...

Embodiment 2

[0073] Figure 3a An embodiment of a semiconductor laser beam combining system designed for combining the beam combining method of the present invention. The laser beam combining system is mainly composed of a semiconductor laser stack 1, a collimating lens group 10 and a beam combining system 6. The semiconductor laser stack 1 is composed of 4 semiconductor laser units; the collimating lens group is placed on the semiconductor The laser laser exit place includes a fast-axis collimating lens 2 and a slow-axis collimating array 3, wherein the fast-axis collimating lens can be a collimating D-type aspherical lens; the slow-axis collimating array is a single array cylindrical lens; The beam combining system 6 is placed in the outgoing direction of the collimated laser beam, and is composed of two parallelepiped prisms 7. The two parallelepiped prisms 7 are placed parallel to each other at equal intervals, and the placement positions are fixed in the vertical direction in turn. S...

Embodiment 3

[0086] Figure 5 An embodiment of a semiconductor laser beam combining system designed in conjunction with the beam combining method of the present invention, a high-power semiconductor laser beam combining system includes a semiconductor laser array 1, a collimating lens group 10 and a beam combining device arranged in sequence along the optical path 6. The collimating lens group 10 includes a fast-axis collimating lens 2 and a slow-axis collimating array 3, wherein the fast-axis collimating lens is a collimating D-type aspheric lens, and the slow-axis collimating array is a single-array cylinder lens. The small prism in the prism combination in the beam combiner 6 is selected from a triangular prism 8, and the included angle between the acute angles of two adjacent sides of the parallelepiped prism 9 is 45°. The semiconductor laser stack is divided into upper and lower parts. For example, the semiconductor laser stack 1 includes 4 semiconductor laser units, the upper 2 semi...

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Abstract

The invention provides a high-power semiconductor laser beam combining method. By the method, a laser beam combining light source with fine uniformity, high energy density and half-sized beam diameter can be obtained. The high-power semiconductor laser beam combining method includes the steps: respectively performing fast axis and slow axis collimation for laser beams emitted by semiconductor laser units of a semiconductor laser stack; enabling the collimated laser beams to pass a beam combining device, horizontally emitting parts of the laser beams along an incident optical axis or after double refraction, vertically shifting parts of the laser beams, enabling the other parts of the laser beams to be parallel to the horizontally emitted laser beams after two-time total reflection, and emitting the laser beams in a plug-in beam combining manner.

Description

technical field [0001] The patent of the invention belongs to the field of laser application, and specifically relates to a high-power semiconductor laser beam combination method. Background technique [0002] Semiconductor lasers have the advantages of small size, light weight, high reliability, long service life, and low power consumption. They have been widely used in various fields of the national economy. However, the current popularization and application of semiconductor lasers is restricted by the quality of their beams. The beam quality, brightness and power of semiconductor lasers are important research directions at present. Laser beam combining technology has developed rapidly in recent years. It is a process of improving beam quality, increasing output power, and increasing power density. Laser beam combining technology has been widely used in laser processing and high power fiber coupling products. [0003] Currently commonly used laser beam combining methods...

Claims

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Application Information

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IPC IPC(8): H01S5/40H01S5/06G02B27/28G02B27/10
Inventor 蔡磊刘兴胜杨凯王警卫李小宁
Owner FOCUSLIGHT TECH
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