A cleaning device after peeling off the insulation and shielding layer of high-voltage cables

Abstract

The invention belongs to the field of mechanical and electrical installation engineering, and particularly relates to a cleaning device used after removing of an insulating shielding layer of a high-voltage cable. The cleaning device comprises a tool pressing plate (7), a tool (8), an outer sleeve pipe (9), an inner sleeve pipe (10) and a fixed locating sleeve (11). The tool (8) is placed in a groove in the upper end of the outer sleeve pipe (9), the tool pressing plate (7) is fixed onto the outer sleeve pipe (9) through a screw, a tool fixing screw (13) is used for compressing the tool (8) which is adjusted in place, the outer sleeve pipe (9) and the inner sleeve pipe (10) are in threaded connection, the fixed locating sleeve (11) is of a wedge-shaped structure, the inner sleeve pipe (10) is fixed onto a main cable insulating part(4), the inner sleeve pipe and the main cable insulating part are kept coaxial and the inclination of the right-side wedge-shaped structure of the fixed locating sleeve (11) and the inclination of the right-side wedge-shaped structure of the inner sleeve pipe (10) are uniform. The cleaning device is simple, light, easy to operate, convenient to use and reliable.

Description

technical field [0001] The invention belongs to the field of electromechanical installation engineering, and in particular relates to a cleaning device after the insulation and shielding layer of a high-voltage cable is peeled off. Background technique [0002] In the insulation structure of the high-voltage cable, an insulating shielding layer for improving the potential gradient and preventing partial discharge is provided between the main insulating layer and the copper shielding layer, and the insulating shielding layer is a semiconductor material. During the production process of high-voltage cable ends, the insulation shielding layer needs to be stripped. After stripping off the black semiconductor material, there are still some invisible semiconductor materials remaining on the surface of the main insulation layer. The conventional cleaning method is to use non-conductive aluminum oxide sandpaper to polish Afterwards, wipe clean with cleaning paper. However, this kin...

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Problems solved by technology

However, this kind of operation is easy to cause pollution, or the cleaning is not thorough, resulting in discharge or leakage. If it is light, it will break down after running for a period of time, and if it is serious, it will break down during the withstand voltage test.

There are also operators who use non-conductive hard objects such as glass sheets to scrape the surface of the main insulating layer to remove the remaining semiconductor material during the cleaning process. However, due to the sharpness of the hard object and the difficulty in controlling the scraping force, edges or pits will appear on the main insulating surface. On the one hand, it may weaken the main insulation, on the other hand, it may cause a gap left, and there is a hidden danger of partial discharge

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