Preparation method of substrate
A technology for substrates and alignment marks, which is applied to the photolithographic process of the pattern surface, photographic process coating equipment, instruments, etc., which can solve the impact, affect the COA substrate opening rate and yield rate, and the pattern cannot be accurately aligned, etc. Problems, to achieve accurate alignment, to ensure the effect of opening rate and yield rate
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[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0032] Embodiments of the present invention provide a method for preparing a substrate, such as figure 1 Shown, the preparation method of this substrate comprises:
[0033] Step S101, forming an alignment mark.
[0034] Such as figure 2 As shown, an alignment mark 2 is formed on a base substrate 1 .
[0035] Wherein, the alignment mark 2 on the substrate is formed on the edge of the base substrate 1 while forming the first layer structure on t...
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