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Multi-mode data transmission interconnection device for coarseness dynamic reconfigurable array

A data transmission, multi-mode technology, applied in electrical digital data processing, instruments, digital computer components, etc., can solve the problems of deteriorating computing performance and large interconnection hardware overhead, and achieve easy expansion, good computing performance, and small area. Effect

Active Publication Date: 2014-07-09
SOUTHEAST UNIV
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0008] The fully interconnected structure is actually an extreme case of the partially shared structure, that is, any data register can be shared by all computing units in the array, but the interconnection hardware overhead is huge
[0009] Based on the global shared routing structure, the present invention proposes a multi-mode data transmission interconnector for coarse-grained dynamic reconfigurable arrays, which solves the problem of meeting various computing requirements and deteriorating computing performance

Method used

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  • Multi-mode data transmission interconnection device for coarseness dynamic reconfigurable array
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  • Multi-mode data transmission interconnection device for coarseness dynamic reconfigurable array

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Embodiment Construction

[0040] The present invention will be further described below in conjunction with the accompanying drawings.

[0041] figure 1 It is a structural schematic diagram of the multi-mode data transmission interconnector of the present invention. Such as figure 1 As shown, a multi-mode data transmission interconnector for coarse-grained dynamic reconfigurable arrays is provided, which includes a multi-mode interconnection controller composed of broadcast interconnection registers, multi-organization network interconnection registers, and computing unit self-feedback Interconnect registers and accumulator interconnect registers. The multi-mode interconnection structure module is composed of a broadcast interconnection module, a multi-organization network interconnection module, a computing unit self-feedback interconnection module and an accumulative interconnection module.

[0042]In a specific implementation, the multi-mode interconnection controller is respectively used to store...

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Abstract

The invention discloses a multi-mode data transmission interconnection device for a coarseness dynamic reconfigurable array. The interconnection device comprises a multi-mode interconnection controller and a multi-mode interconnection structure module. The multi-mode interconnection controller is used for storing different interconnection structure selection information and sending the same to the multi-mode interconnection structure module. The multi-mode interconnection structure module is used for selecting one or more interconnection structures from the array according to the interconnection structure selection information of the multi-mode interconnection controller to realize computing element interconnection in the reconfigurable array. By the interconnection device, an interconnection structure meeting multiple computing needs and with good computing performance can be realized on the reconfigurable array; moreover, the interconnection structure has the advantages of easiness in extension, low power consumption and small area.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to a multi-mode data transmission interconnector for a coarse-grained dynamically reconfigurable array. Background technique [0002] At present, the reconfigurable structure originates from FPGA (Field-Programmable Gate Array). As an emerging hardware processor structure, it combines the flexibility of general-purpose processor software execution with the high efficiency of ASIC. It has been widely used in the field of communication, media application, encryption and other fields. Its research and development cycle is short and its power consumption is low. It has been accepted by more and more fields and has a broad space for development. [0003] Since interconnection resources occupy nearly 70% of chip area in FPGA, interconnection delay occupies 50%-60%. Coarse-grained reconfigurable structure, as a type of reconfigurable structure, due to the large calculation granularity, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F15/173
Inventor 刘波曹鹏刘炎朱婉瑜杜月张亚杨锦江
Owner SOUTHEAST UNIV
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