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Surface sinkage measuring method and measuring device thereof

A measurement equipment and measurement technology, applied in measurement devices, instruments, optical devices, etc., can solve the problems of scratching the surface of the object to be measured, the wear life of the contact probe, and the long time required to achieve accurate and stable The effect of measurement results, low damage rate, and fast detection speed

Inactive Publication Date: 2014-07-09
WISTRON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Using thickness gauges with visual inspection, the accuracy and measurement efficiency are extremely poor, and the measurement methods and criteria cannot be effectively quantified and standardized, and the measurement results cannot be digitized
[0004] The advantage of using a single-point digital electronic meter to measure the sinkage is that the measurement result can be digitized. However, since this method is a single-point measurement, it takes time to complete the measurement of the sinkage of the lower surface of the overall casing. relatively long
In addition, the single-point digital electronic gauge is a contact measuring instrument, so the contact probe of the gauge has a wear-and-tear service life problem
And may scratch the surface of the object to be tested

Method used

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  • Surface sinkage measuring method and measuring device thereof
  • Surface sinkage measuring method and measuring device thereof
  • Surface sinkage measuring method and measuring device thereof

Examples

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Embodiment Construction

[0026] refer to figure 1 , figure 2 as well as image 3 , which shows the surface subsidence measurement device 1 according to the embodiment of the present invention, which is used to measure the subsidence of a casing surface 21 (lower surface) of a device 2 . The surface subsidence measurement device 1 includes a support frame 11 , a light source 12 , a receiver 13 and a control unit (not shown). The support frame 11 supports the device 2 . The light source 12 provides a light 121 , wherein the light source 12 is located on a reference plane B, and the light 121 travels along a horizontal direction. The receiver 13 receives the light 121 , wherein the receiver 13 is also located on the reference plane B. refer to figure 1 , when the subsidence of the casing surface 21 of the device 2 exceeds the allowable value, the casing surface 21 interferes with the reference plane B and prevents the receiver 13 from receiving the light 121 . refer to figure 2 , when the subsid...

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PUM

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Abstract

The present invention provides a surface sinkage measuring method and a measuring device thereof. The surface sinkage measuring device is used for measuring sinkage of a surface of a casing of an apparatus, and comprises a supporting frame, a light source, a receiver and a control unit. The supporting frame supports the apparatus. The light source provides a light, wherein the light source is arranged at a reference plane, the light advances along a horizontal direction. The receiver receives the light, wherein the receiver is arranged at the reference plane, when the sinkage of the surface of the casing of the apparatus exceeds an allowable value, interference occurs between the surface of the casing and the reference plane to block the receiver from receiving the light. The control unit is coupled to the receiver, the control unit judges whether the case that the surface of the casing of the apparatus exceeds the allowable value occurs according to whether the receiver receives the light. The present invention can quickly detect the sinkage of the surface.

Description

technical field [0001] The invention relates to a method for measuring surface subsidence and its measuring equipment, in particular to a method for measuring surface subsidence and its measuring equipment for rapid detection. Background technique [0002] In the prior art, in order to obtain the data of the subsidence of the casing surface of the device (for example, the server mainframe), it is generally measured with a thickness gauge and visual inspection, or with a single-point digital electronic gauge. Measurement. [0003] The accuracy and efficiency of measuring with a thickness gauge combined with visual inspection are extremely poor, and it is impossible to effectively quantify and standardize the measurement methods and criteria, and the measurement results cannot be digitized. [0004] The advantage of using a single-point digital electronic meter to measure the sinkage is that the measurement result can be digitized. However, since this method is a single-point...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/02
Inventor 陈冠文陈大卫
Owner WISTRON CORP
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