Adhesive film having good machinability for protecting the surface of semiconductor wafer

An adhesive film, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, film/sheet adhesives, etc., can solve the problems of wafer bending and inability to ensure dicing, and achieve bending phenomenon prevention and resistance. sex-reducing effect

Active Publication Date: 2014-07-02
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this regard, there is actually a problem that a large amount of warping occurs when the wafer becomes thinner after the wafer is coated and the cutability cannot be ensured.
Korean Laid-Open Patent No. 2003-0061300 describes temperature-based stiffness, but still fails to propose a solution to the above-mentioned problems

Method used

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  • Adhesive film having good machinability for protecting the surface of semiconductor wafer
  • Adhesive film having good machinability for protecting the surface of semiconductor wafer
  • Adhesive film having good machinability for protecting the surface of semiconductor wafer

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0036] Preparation method of adhesive film for wafer surface protection

[0037] The present invention provides a method for preparing an adhesive film for protecting the surface of a semiconductor wafer, which is characterized in that it comprises: a step of forming a substrate film; a step of controlling the tensile strength and elongation at break of the substrate film; A step of forming an adhesive layer on one surface; and a step of ultraviolet curing the substrate film on which the adhesive layer is formed.

[0038] The process of forming the base film includes an extrusion process, an ultraviolet curing process, a casting process, a calendering process, a thermal curing process, and the like.

[0039] Preferably, an acrylic film is formed by ultraviolet curing, an ethylene-vinyl acetate copolymer film and a polyolefin film are formed by an extrusion process, and a polyurethane film is formed by a thermal curing process. And, a polyvinyl chloride film is formed through ...

experiment example 1

[0055] Experimental Example 1: Cutting property of substrate film and measurement of cutting property

[0056] Examples and Comparative Examples

[0057] In Table 1 and Table 2 below, different types of base films are used, and the tensile strength and elongation at break are controlled to be different according to the process of forming the base film to measure the cuttability and cutability of the above base film. .

[0058] Table 1

[0059]

[0060] Table 2

[0061]

[0062] Evaluation method

[0063] Prepare the base film of the above table 1 and table 2 with a thickness of 100um into a size of 5cm x 1cm horizontally and vertically, clamp the upper part and the lower part with jigs in a tensile testing machine, and place them on a load cell (10ad cell ) Tensile test was carried out under a load of 30 kg. In this case, the horizontal axis represents the distance (distance), and the vertical axis represents the elongation at break shown by the force curve (curve),...

experiment example 2

[0073] Experimental example 2: Determination of the gel content of the adhesive layer and the peeling force of the adhesive film

[0074] Examples and Comparative Examples

[0075] As shown in Table 5 and Table 6, base films were formed according to different types, and an adhesive layer was formed on one side of the formed base film by the comma coating method. The above-mentioned adhesive layer includes an acrylic resin composition, and the composition of the above-mentioned acrylic resin composition is, relative to 100 parts by weight of the total amount of the acrylic resin composition, 60 parts by weight of ethylhexyl acrylate, 20 parts by weight of methyl acrylate , 20 parts by weight of hydroxyethyl acrylate. Afterwards, above-mentioned resin composition is mixed in solvent ethyl acetate, after dropping into as thermal initiator azobisisobutyronitrile (2,2-azobisisobutyroni-trile, AIBN Japan) 0.01 weight part with respect to resin composition total amount, The tempera...

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Abstract

The present invention relates to an adhesive film for protecting a wafer including an adhesive layer formed on one surface of a substrate film. The present invention relates to an adhesive film for protecting the surface of a semiconductor wafer, wherein the surface film has a tensile strength of 2-10 kg / mm2 and an elongation until breakage of 50-200%, and the gel content of the adhesive layer is greater than or equal to 80%. The adhesive film for protecting the wafer maintains cutting ability and machinability, while preventing the generation of bending and wafer breaking phenomena due to the decrease of the wafer thickness. In addition, the adhesive film may not melt at high temperatures, and the yield while grinding the wafer may be increased.

Description

technical field [0001] The present invention relates to an adhesive film for semiconductor wafer protection in which an adhesive layer is formed on one surface of a base film. Background technique [0002] The adhesive film for semiconductor wafer protection is in the shape of a wafer, and when cutting the film, it needs to be able to cut fully without resistance under any conditions. This property is called cutting property or cutting property. Regarding this, there is actually a problem in that a large amount of warping occurs when the wafer becomes thinner and the cutability cannot be ensured after the wafer is coated. Korean Laid-Open Patent No. 2003-0061300 describes temperature-based stiffness, but still fails to propose a solution to the above-mentioned problems. [0003] Generally, the thickness of the adhesive used as a wafer protection film is thin, so it has little effect on the cuttability, but the effect of the polymer film used as the base film is very large, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C08J5/18C08J7/04H01L21/301C08J7/043C08J7/046
CPCH01L21/6836C08J5/18C08J7/04H01L2221/68327H01L2221/6834C09J7/02C08J7/18C08J2375/16C09J7/20Y10T428/28Y10T428/266C08J7/0427C08J7/043C08J7/046C09J7/22C09J7/40C09J2203/326C09J2301/40C09J2301/416C09J2301/312
Inventor 金章淳赵显珠徐周用
Owner LG CHEM LTD
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