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Water-cooled heat dissipation device

A water-cooled radiator and heat-dissipating column technology, applied in the field of heat dissipation, can solve the problems of weakening, easy aging of the sealing ring, and affecting the service life of the water-cooled radiator.

Inactive Publication Date: 2014-07-02
黄山谷捷股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current electronic industry is developing rapidly, and many electronic devices will involve heat dissipation. To dissipate heat from electronic devices, radiators must be used. However, the existing water-cooled radiators are generally in the form of sealing rings. Sealing, the sealing ring is easy to age in the long-term operating environment and the sealing performance is weakened, thus affecting the service life of the water-cooled radiator

Method used

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Embodiment Construction

[0019] Attached below Figures 1 to 6 The present invention is described in further detail.

[0020] refer to Figure 1 to Figure 4 , provides a water-cooled radiator, including a heat dissipation body 4 and a plurality of heat dissipation columns 201 . The heat dissipation main body 4 includes a base 1 and a cover plate 2 that can be interlocked with the base 1. The base 1 is provided with a water inlet 103, a water outlet 104, and an accommodating chamber 101 that communicates with the water inlet 103 and the water outlet 104. The water inlet 103 and the water outlet 104 are respectively located at two ends of the accommodating cavity 101 . The side surface 203 of the cover plate 2 is evenly distributed with heat dissipation columns 201 , and the plurality of heat dissipation columns 201 can be cylinders or cuboids, or can also be frustum of cones for the convenience of processing. In this embodiment, they are cylinders. The plurality of heat dissipation columns 201 and t...

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Abstract

The invention discloses a water-cooled heat dissipation device. The water-cooled heat dissipation device comprises a heat dissipation body and a plurality of heat dissipation columns. The heat dissipation body comprises a base and a cover plate, wherein the base and the cover plate can be buckled with each other. The base is provided with a water inlet, a water outlet and a containing cavity communicated with the water inlet and the water outlet. The multiple heat dissipation columns are arranged in the containing cavity. Friction stir welding or electron beam welding or vacuum brazing sealing is adopted between the base and the cover plate. The water-cooled heat dissipation device has the advantages that the structure that the heat dissipation columns are arranged in the containing cavity or on the side face of the cover plate and can be buckled in the containing cavity, friction stir welding or electron beam welding or vacuum brazing sealing is adopted between the base and the cover plate for sealed connection is adopted, so that the sealing effect of the whole water-cooled heat dissipation device can be improved, and the service life of the water-cooled heat dissipation device is prolonged.

Description

technical field [0001] The invention relates to heat dissipation technology, in particular to a water cooling radiator. Background technique [0002] The current electronic industry is developing rapidly, and many electronic devices will involve heat dissipation. To dissipate heat from electronic devices, radiators must be used. However, the existing water-cooled radiators are generally in the form of sealing rings. Sealing, the sealing ring is relatively easy to age in a long-term operating environment and the sealing performance is weakened, thus affecting the service life of the water-cooled radiator. Contents of the invention [0003] The water cooling radiator provided by the present invention solves one or more of the above technical problems. [0004] According to one aspect of the present invention, a water-cooled radiator is provided, which includes a heat dissipation body and a plurality of heat dissipation columns, and the heat dissipation body includes a base ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 吴斌周斌郑臻轶
Owner 黄山谷捷股份有限公司
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