Photosensitive resin composition for light blocking layer and light blocking layer using the same
A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition for light-blocking layer and light-blocking layer using the same, can solve the problems of reducing optical density and the like
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[0164] (Preparation of photosensitive resin composition for light-shielding layer)
[0165] A photosensitive resin composition for a light blocking layer was prepared using the following components.
[0166] (A) colorant
[0167] (A-1) Blue material
[0168] (A-1-1) A dye represented by the following Chemical Formula 4 (cyan-1, KISCO) was used.
[0169] [chemical formula 4]
[0170]
[0171] (A-1-2) A mill base (mill base) containing pigment V23 manufactured by BASF Corporation (Sakata Co., Ltd.) was used.
[0172] (A-1-3) A color paste (Sakata Co., Ltd.) containing Pigment B15:6 represented by the following Chemical Formula 18 and manufactured by BASF Corporation was used.
[0173] [chemical formula 18]
[0174]
[0175] (A-2) Red material
[0176] Orange 63 (Sakata Co., Ltd.) was used.
[0177] (B) Binder resin
[0178] As the cardo-based binder resin, V259ME produced by NSCC was used.
[0179] (C) Photopolymerizable monomer
[0180] Dipentaerythrito...
Embodiment 1 and 2 and comparative example 1
[0188]A photosensitive resin composition for a light blocking layer was prepared by mixing components according to the compositions provided in Table 1 below. Specifically, a photopolymerization initiator was dissolved in a solvent, and the solution was stirred for 30 minutes. Then, a binder resin and a photopolymerizable monomer are sequentially added thereto. The mixture was stirred for 1 hour. Then, the additives are added to the stirred mixture, and finally the colorant is added thereto. Stir the resulting mixture for more than or equal to 2 hours to prepare a photosensitive resin composition for a light-shielding layer.
[0189] (Table 1) (Unit: wt%)
[0190]
[0191] Evaluation 1: Elution of metal ions
[0192] Each of the photosensitive resin compositions for the light-shielding layer according to Examples 1 and 2 and Comparative Example 1 was coated with a thickness of 2.0 μm on the predetermined pretreated substrate, respectively, and then heated at 90° C. fo...
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