Lower disc device for two-sided precision grinding and polishing combined machine tool

Abstract

The invention discloses a lower disc device for a two-sided precision grinding and polishing combined machine tool. The lower disc device comprises a chassis support, an upper static pressure disc arranged on the chassis support, a lower static pressure disc arranged at the bottom of the upper static pressure disc, a central shaft arranged in the middle of the upper static pressure disc and the lower static pressure disc, and a hollow shaft movably arranged on the central shaft in a sleeved mode. A sun wheel is arranged at the top end of the central shaft; a central rotary disc and a lower supporting disc are fixed to the hollow shaft, wherein the central rotary disc is in sliding fit with the inner circumferential face of the upper static pressure disc and the upper surface of the lower static pressure disc, and the lower supporting disc is fixed to the central rotary disc; a lower disc grinding wheel in sliding fit with the upper surface of the upper static pressure disc is arranged on the lower supporting disc; the upper face, the lower face and the inner circumferential face where the upper static pressure disc is in sliding fit with the lower supporting disc are provided with an upper oil cavity, a lower oil cavity and a middle oil cavity respectively; the upper face, the lower face and the inner circumferential face where the lower static pressure disc is in sliding fit with the central rotary disc are provided with an upper oil cavity, a lower oil cavity and a middle oil cavity respectively. According to the lower disc device, grinding and polishing accuracy and efficiency of hard and brittle materials machined by two-sided grinding and polishing equipment can be improved.

Description

technical field [0001] The invention belongs to grinding, grinding and polishing equipment, in particular to a lower plate device for double-sided precision grinding and grinding combined machine tools. Background technique [0002] Hard and brittle materials such as sapphire require high grinding and polishing pressure, high linear speed, and no vibration during processing. During the processing process, a large amount of heat will be generated when grinding and polishing under high pressure and high speed. The existing double-sided grinding and polishing machine tools all adopt rolling bearing structure, and the disk surface cannot be cooled. If it is used to process hard and brittle materials such as sapphire, the grinding and polishing pressure is small, the vibration is large, and the temperature is high. The polishing accuracy, processing efficiency and The service life of the equipment is difficult to guarantee. Therefore, the existing double-sided grinding and polis...

AI Technical Summary

Problems solved by technology

Existing double-sided grinding and polishing machine tools all adopt rolling bearing structure, and the disk surface cannot be cooled. If it is used to process hard and brittle materials such as sapphire, the grinding and polishing pressure is small, the vibration is large, and the temperature is high. The polishing accuracy, processing efficiency and The service life of the equipment is difficult to guarantee

Therefore, the existing double-sided grinding and polishing equipment cannot adapt to the processing of hard and brittle materials such as sapphire.

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