Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A soft substrate light source module and its manufacturing method

A technology of light source module and soft substrate, applied in the direction of light source, point light source, slender light source, etc., can solve the problems of inconvenient testing and maintenance, and achieve the effect of convenient daily testing and maintenance and easy disassembly

Active Publication Date: 2017-04-26
苏州国科盈睿医疗科技有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to disassemble the soft substrate installed by bonding with the heat dissipation components, which will cause inconvenience to the subsequent testing and maintenance of the soft substrate and the light-emitting elements installed on it.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A soft substrate light source module and its manufacturing method
  • A soft substrate light source module and its manufacturing method
  • A soft substrate light source module and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] like Figure 1 to Figure 6 As shown, the soft substrate light source module provided in this embodiment includes: a light emitting element 1, a soft substrate 2 for installing the light emitting element 1, and a heat dissipation member 3 formed with a slot 31 for placing the soft substrate 2, and The flexible substrate 2 is fixed on the heat dissipation member 3 by fasteners 4 .

[0054] In the soft substrate light source module provided in this embodiment, firstly, the slot 31 is used to limit and fix the soft substrate 2, and then the soft substrate 2 is fixed on the heat dissipation member 3 by the fastener 4, Thus, a soft substrate light source module is formed; the installed soft substrate 2 and heat dissipation member 3 are easy to disassemble, which is convenient for daily testing and maintenance.

[0055] In this embodiment, when installing the soft substrate light source module, the soft substrate 2 needs to be installed and snapped into the card slot 31, but ...

Embodiment 2

[0065] This implementation provides a method for manufacturing the soft substrate light source module in Embodiment 1, including:

[0066] Step 101, manufacturing the soft substrate;

[0067] Step 102, mounting the light-emitting element on the soft substrate;

[0068] Step 103, opening the card slot on the heat dissipation member;

[0069] Step 104 , placing the soft substrate in the slot, and fixing the soft substrate on the heat dissipation member through the fastener.

Embodiment 3

[0071] This implementation provides a method for manufacturing the soft substrate light source module in Embodiment 1, including:

[0072] Step 201, manufacturing the soft substrate;

[0073] Step 202, mounting the light-emitting element on the soft substrate;

[0074] Step 203, stamping and forming the through hole on the soft substrate;

[0075] Step 204, stamping and forming the card slot and the installation hole on the heat dissipation member;

[0076] Step 205 , placing the soft substrate in the slot, and fixing the soft substrate on the heat dissipation member through the fastener.

[0077] In this embodiment, in order to facilitate mass production, installation and production of soft substrate light source modules, a full-page soft substrate can be manufactured first, and then a plurality of light-emitting elements can be arranged on the soft substrate in the corresponding area according to actual use needs, and then the soft substrate can be installed. The substrat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention proposes a soft substrate light source module, including: a light-emitting element, a soft substrate for installing the light-emitting element, and a heat dissipation member formed with a slot for placing the soft substrate, and the soft substrate is fixed on the heat dissipation device by a fastener. On the component, it first uses the card slot to limit and clamp the soft substrate, and then fix the soft substrate on the heat dissipation component through fasteners, thereby forming a soft substrate light source module; the installed soft substrate It is easy to disassemble with heat dissipation components, which is convenient for daily testing and maintenance; the present invention also provides a method for manufacturing the soft substrate light source module, and the soft substrate and heat dissipation components in the soft substrate light source module produced by it are easy to disassemble and assemble, which is convenient for daily use. testing and maintenance.

Description

technical field [0001] The invention relates to the technical field of semiconductor lighting, in particular to a soft substrate light source module and a manufacturing method thereof. Background technique [0002] The semiconductor light source module has the advantages of long life and power saving, so it is more and more used in the field of lighting. [0003] Common semiconductor light source modules are mostly soft substrate light source modules. It is made by fixedly installing the light-emitting element on the soft substrate, and then installing the soft substrate on the heat dissipation component. Among them, the soft substrate is mainly made of an interconnected circuit copper layer for forming the upper surface, a heat dissipation copper layer for forming the lower surface, and a polymer flexible material arranged between the upper surface layer and the lower surface layer. [0004] At present, when the soft substrate is installed on the heat dissipation componen...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L25/075
CPCF21V19/001F21Y2101/00F21Y2103/10F21Y2115/10
Inventor 牛琳韦嘉梁润园袁长安张国旗
Owner 苏州国科盈睿医疗科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com