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Packaging method of LED (light emitting diode) light source module

A technology of LED light source and packaging method, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of blackening of chips, easy absorption of moisture, and impact on lifespan, etc.

Inactive Publication Date: 2014-05-21
中普天诚(天津)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with silver glue is that it needs to be completely dried. If it is not dried, it will easily absorb water and react with the packaging glue, causing blackening of the chip and affecting the lifespan.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0004] The packaging method of the LED light source module of the present invention is to use the mirror aluminum base plate as a support, package a plurality of low-power LED chips into a high-power integrated LED chip light source, and directly weld the wire / bonding wire on the gold-plated circuit of the PCB , and then use dispensing technology to package with LED encapsulation glue.

[0005] The power of the above-mentioned low-power LED chip is 0.06W to 0.5W, and the high power of the integrated LED chip can be realized through serial-parallel connection of multiple low-power LED chips.

[0006] The above-mentioned dispensing technology is a digital dispensing technology that uses a screw dispensing machine to realize micro-dispensing of glue droplets with a diameter of ≤0.25mm, and forms various expected patterns from adjacent glue droplets.

[0007] The method of using LED packaging glue is as follows: (depending on the choice of different packaging glue, the curing time...

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PUM

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Abstract

Disclosed is a packaging method of an LED light source module. The method comprises taking a mirror face aluminum substrate as a support, packaging a plurality of low-power LED wafers into a high-power integrated LED chip, directly welding wires / bonding wires onto the plated wires of a PCB (printed circuit board), and performing packaging with LED packaging adhesive in an adhesive dispensing technology. The packaging method of the LED light source module has the advantages of being high in cost effectiveness, simple in wire design and capable saving the system board space.

Description

technical field [0001] The invention relates to an LED light source, in particular to a packaging method for an LED light source module. Background technique [0002] The original packaging method of the LED light source module is a single-point high-power chip packaging method, that is, a square aluminum substrate and a 12-point packaging method. This packaging method has a long processing time, and its light efficiency is about 55-60lm per watt, and the amount of packaging glue used is also large, and silver glue is required for the die-bonding glue. The problem with silver glue is that it needs to be completely dried. If it is not dried, it will easily absorb water and react with the encapsulant, causing blackening of the chip and affecting the lifespan. Contents of the invention [0003] A packaging method for an LED light source module, characterized in that a plurality of low-power LED chips are packaged into a high-power integrated LED chip light source with a mirr...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/62H01L33/56
Inventor 宋俊伟
Owner 中普天诚(天津)科技有限公司
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