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Wafer?immersion?device

A wafer and wafer technology, which is applied in the field of wet wafer processing in the semiconductor industry, can solve the problems of the uniformity of soaking time and waiting time of a single wafer, and achieve the advantages of speeding up processing efficiency and uniformity, reducing process processing time and facilitating maintenance. Effect

Active Publication Date: 2014-05-21
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem of the uniformity of the soaking time of a single wafer and the waiting time after taking it out during the wafer soaking process, the main purpose of the present invention is to provide a wafer soaking device for time-sharing transfer

Method used

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Embodiment Construction

[0019] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0020] Such as figure 1 , figure 2 As shown, the present invention includes a film box 2, a liquid storage tank 3, a base plate 4, a support 5, an electric actuator 6, an ultrasonic generator 7, an inclined connecting rod 9, an inclined cylinder 10, a lifting connecting rod 11, a film transfer window 12, The heating plate 13, the baffle plate 14 and the lifting cylinder 15, wherein the liquid storage tank 3 is fixed on the bottom plate 4, is a closed cavity, the upper part of the liquid storage tank 3 is a cuboid or a cube, and the lower part is a drum shape; the electric actuator 6 passes through The bracket 5 is fixed on the bottom plate and is located on one side of the liquid storage tank 3 . Cassette 2 is located in liquid storage tank 3, and can be loaded with a plurality of wafers 1 in the cassette 2; connected, the other end is inserted into the l...

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Abstract

The invention belongs to the field of wafer wet processing in the semiconductor industry and particularly relates to a wafer?immersion?device which can meet the immersion demands of the wafers. The device comprises a wafer box, a liquid storage tank, a bottom plate, an electric actuator, a lifting connection rod, and a wafer transport window, wherein the liquid storage tank and the electric actuator are respectively arranged on the bottom plate; the wafer box is located inside the liquid storage tank; one end of the lifting connection rod is connected with the output end of the electric actuator and the other end is inserted inside the liquid storage tank to be hinged with the wafer box; chemical liquid for immersing the wafers is contained at the inner lower part of the liquid storage tank; the wafer transport window for enabling a manipulator to transport the wafers in the wafer box is arranged in the groove wall of the upper part; the electric actuator drives the lifting connection rod to drive the wafer box to rise and fall to enable the wafer box to rise to the height corresponding to the wafer transport window for fetching or placing the wafers or enable the wafer box to fall to be immersed below the chemical liquid to make the wafer immersed. According to the wafer?immersion?device, the electric actuator drives the lifting connection rod to drive the wafer box to rise and fall in a time-sharing wafer transport mode, and uniformity of single wafer immersion time and waiting time after taking out can be realized.

Description

technical field [0001] The invention belongs to the field of wafer wet processing in the semiconductor industry, in particular to a wafer soaking device meeting the wafer soaking requirements. Background technique [0002] At present, the wafer wet processing process in the semiconductor industry often requires the use of chemical liquid to soak the wafer. The current wafer soaking method generally uses the whole box of wafers to be soaked in the chemical liquid tank at the same time, and then the whole box is taken out for the next process after the predetermined time; The wafers are processed sequentially, which results in a different waiting time for each piece of the whole box of wafers, which may affect the quality of the final chip. Therefore, how to achieve the uniformity of soaking time for each wafer is an inevitable problem. Contents of the invention [0003] In order to solve the problem of uniformity of soaking time and waiting time after taking out a single ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67023H01L21/67745
Inventor 谷德君张浩渊卢继奎
Owner SHENYANG KINGSEMI CO LTD
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