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Developing method

A developing method and developing solution technology, applied in the processing of photosensitive materials, etc., can solve problems such as uneven development, achieve the effect of shortening coating time and improving line width uniformity

Active Publication Date: 2016-12-21
SHENYANG KINGSEMI CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] The object of the present invention is to provide a developing method, which can improve the phenomenon of uneven developing and improve the uniformity of line width at the same time

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Embodiment Construction

[0016] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0017] The schematic diagram of the developing method of the present invention is as Figure 1-2 As shown, the method includes the following steps: first, the wafer 101 whose surface is coated with photoresist and whose exposure process has been completed is fixed on the wafer stage 201 of the developing device, and the wafer 101 can rotate with the wafer stage 201, The developing nozzle 102 is connected with the nozzle pipe 103, and the developer is input into the developing nozzle 102 through the nozzle pipe 103, and then sprays wine on the surface of the wafer for development. The length of the developing nozzle 102 is greater than the diameter of the wafer 101 .

[0018] Before developing, the developing nozzle 102 is located directly above the initial position point A on the side of the center (O point) of the wafer 101, and OA=10-20cm. The rotation rate of th...

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Abstract

The invention discloses a developing method for obtaining a photoresist pattern on a semiconductor wafer. In the method, firstly, a developing device and the wafer are provided, and the developing device includes a developing sprinkle nozzle for sprinkling a developing liquid and a wafer chuck which can rotate; the wafer is fixedly arranged on the wafer chuck, and when the wafer rotates along with the wafer chuck, the developing sprinkle nozzle can perform lateral movement above the wafer; and then while the water chuck rotates, the developing sprinkle nozzle moves from the right upside of an initial position of one side of the wafer to the right upside of an ending position of the other side of the wafer, and the wafer is coated with the developing liquid. The method ensures uniform coverage of the developing liquid on the wafer through the rotation of the wafer chuck and the movement of the developing sprinkle nozzle, so that developing on the whole wafer reaches an equilibrium state, the problems of nonuniform coverage of the developing liquid and poor uniformity of a line width during the developing process in the prior art are solved, and the uniformity of the line width is improved.

Description

technical field [0001] The invention relates to a photoresist development process, in particular to a development method for obtaining a photoresist pattern on a semiconductor wafer. Background technique [0002] The photolithography process is a very important process step in the entire semiconductor manufacturing process. The photolithography process mainly includes gluing, exposure and development, etc. As the wafer size increases and the requirements for development resolution increase, the requirements for line width uniformity in the process are also increasing. Among them, development has a great influence on line width uniformity. In the past, the development method often caused the problem of uneven coverage of the developer solution at the center and edge of the wafer, resulting in poor line width uniformity. Contents of the invention [0003] The object of the present invention is to provide a developing method, which can improve the phenomenon of uneven devel...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/30
Inventor 张浩渊谷德君
Owner SHENYANG KINGSEMI CO LTD
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