Method for preparing graphene-based chip heat-radiating material
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A chip heat dissipation and graphene technology, applied in the field of microelectronics, can solve the problems of poor horizontal and vertical heat dissipation of high-power chips, achieve the effects of inhibiting horizontal film growth, simple process, and low requirements for the preparation environment
Active Publication Date: 2014-05-07
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a method for preparing a graphene-based chip heat dissipation material, which is used to solve the problem of poor horizontal and vertical heat dissipation of high-power chips in the prior art
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Embodiment 1
[0049]The invention provides a method for preparing a graphene-based chip heat dissipation material, and the preparation method of the graphene-based chip heat dissipation material at least includes the following steps:
[0050] 1) Provide a substrate, and prepare horizontal graphene on the substrate by liquid phase exfoliation method;
[0051] 2) placing the substrate in a reaction chamber, vacuumizing the reaction chamber, introducing a reducing gas and raising the temperature to a preset temperature, and then performing plasma pretreatment on the substrate;
[0052] 3) Keep feeding the reducing gas and feeding the growth gas, and use plasma-enhanced chemical vapor deposition to grow vertical graphene on the surface of the horizontal graphene;
[0053] 4) Stop feeding the growth gas, cool down the reaction chamber, and then transfer the horizontal graphene and vertical graphene to the surface of the chip to be dissipated.
[0054] The preparation method of the graphene chip...
Embodiment 2
[0081] The difference between this embodiment and Embodiment 1 is that this embodiment prepares a layer of horizontal graphene 104 on the surface of the vertical graphene 103 prepared in Embodiment 1, such as Figure 10 As shown, the method for preparing the horizontal graphene layer 104 can be the same as the method for preparing the horizontal graphene 102 in the first embodiment. Specifically, the steps of the preparation method of the graphene-based chip heat dissipation material of the present embodiment are as follows:
[0082] 1) Provide a substrate 101, and prepare horizontal graphene 102 on the substrate 101 by liquid phase exfoliation method;
[0083] 2) placing the substrate 101 in a reaction chamber, vacuumizing the reaction chamber, introducing a reducing gas and raising the temperature to a preset temperature, and then performing plasma pretreatment on the substrate 101;
[0084] 3) Keep feeding the reducing gas and feeding the growth gas, and grow the vertical ...
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Abstract
The present invention provides a method for preparing a graphene-based chip heat-radiating material, which comprises the steps of: providing a substrate on which horizontal graphene is prepared; placing the substrate in a reaction chamber, after vacuum pumping is performed on the reaction chamber, reducing gas is introduced into the reaction chamber and increasing the temperature to a preset temperature, and then performing plasma preprocessing on the substrate; introducing of the reducing gas is kept and furthermore growing gas is introduced for growing vertical graphene on the surface of the horizontal graphene; and stopping introduction of the growing gas and reducing temperature of the reaction chamber, and then transferring the horizontal graphene and the vertical graphene to the surface of the chip on which heat radiation is to be performed. According to the method, the hot spot heat which is generated by operation of the device is radiated to the surface of the device through the horizontal graphene, and then relatively large specific surface area of the vertical graphene is utilized for radiating heat of a large-power chip in the horizontal direction to surrounding environment through the large specific surface area, thereby improving heat radiating efficiency. The method for preparing the graphene-based chip heat-radiating material has advantages of: simple process, easy operation and low requirement for preparing environment.
Description
technical field [0001] The invention relates to the technical field of microelectronics, and relates to a method for preparing a graphene-based chip heat dissipation material, in particular to a preparation method for a chip heat dissipation material based on horizontal graphene and vertical graphene. Background technique [0002] With the development of high performance, miniaturization, multi-function and low cost of microelectronic products, the problem of electronic heat dissipation has become an important factor restricting the rapid development of the electronic industry. Such as more diversified functional design, the weight of electronic products and other issues, the solution of these problems will inevitably lead to the problem of device heat dissipation, and the research of high-performance thermal conductive materials is imminent. At present, people are actively looking for new high-performance heat-conducting materials. Represented by graphene, new two-dimension...
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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373C01B31/04C09K5/14C01B32/188
Inventor 王浩敏王玲张燕谢晓明刘建影
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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