Cutting dust suction apparatus and cutting method

Abstract

The invention discloses a cutting dust suction apparatus, which is arranged on a cutting machine and comprises the cutting machine and a dust suction device, wherein the dust suction device comprises a plurality of dust suction pipelines, the dust suction pipelines are positioned on the outer periphery of the cutting machine, one end of each dust suction pipeline is a dust suction port, the other end is a gas source port, the dust suction ports of the dust suction pipelines are positioned around the bottom of the cutting machine, and the dust suction pipelines suck debris generated during cutting through the dust suction ports during glass cutting. The invention further provides a cutting method of the cutting dust suction apparatus, wherein the method can be used for cutting thin glass substrates, the mechanical cutting machine is adopted, and the dust suction pipelines suck debris generated during cutting through the dust suction ports during glass cutting.

Description

technical field [0001] The invention relates to a cutting dust suction device and a cutting method, in particular to a cutting dust suction device and a cutting method capable of cutting thin glass substrates without scattering glass debris. Background technique [0002] The glass substrate is a very important component in the OLED display, and it is necessary to form the TFT control circuit and the organic light-emitting layer on the glass substrate. [0003] Figure 1A to Figure 1C Schematic diagram of the mechanical cutting process for glass substrates, Figure 1D It is a schematic cross-sectional view of cutting a glass substrate with a cutter wheel. First, the completed glass substrate 100 is assembled. The glass substrate 100 has multiple strips such as Figure 1A Cutting lanes 104 are shown. [0004] A cutting process is performed on the glass substrate 100 to form a plurality of display panels 110, such as Figure 1B shown. The cutting process is to use Figur...

AI Technical Summary

Problems solved by technology

[0010] However, as the thickness of the glass substrate becomes thinner, when using laser cutting with scribed lobes, unstable full cuts can occur simultaneously with the scribed lobes

If the full cutting occurs in the first step of the scribing lobes, the cracks formed by the subsequent laser processing will not be able to cross the full-cut section, and the scribing lobes will fail.

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