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Soldering Tooling for Antenna Backing Micro Connectors

A technology of miniature connectors and welding tooling, which is applied in welding equipment, auxiliary devices, metal processing, etc., to achieve the effect of uniform heating and sufficient return of hot air

Active Publication Date: 2016-08-17
NO 20 RES INST OF CHINA ELECTRONICS TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] So far, many years of work practice and no related reports about this connector welding process in the industry

Method used

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  • Soldering Tooling for Antenna Backing Micro Connectors
  • Soldering Tooling for Antenna Backing Micro Connectors
  • Soldering Tooling for Antenna Backing Micro Connectors

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The present invention will be further described below in conjunction with the accompanying drawings and embodiments, and the present invention includes but not limited to the following embodiments.

[0023] The present invention is different from the conventional method of printing solder paste in surface mounting technology (SMT), and uses a tool for applying solder paste on a connector with a special structure.

[0024] The invention includes a set of tools for applying solder paste and a pair of frames.

[0025] The solder paste coating tool is composed of copper rod 2 and steel needle 1, the most critical size of copper rod 2, see image 3 Middle right end—the size of the shaft end matched with the inner ring surface of the miniature connector 3, the assembly relationship belongs to the base hole system in the shaft and the hole, and the clearance fit is preferred Process the shaft end size of the copper rod 2 within the tolerance range, and try it with the micro ...

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PUM

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Abstract

The invention provides a welding tool for an antenna lining plate and a micro connector. The welding tool comprises a welding paste coating tool and a frame, the welding paste coating tool comprises a copper rod and a steel needle, one end of the copper rod is matched with the inner ring surface of the micro connector, one end of the steel needle is ground into a needle point shape, the frame comprises a rectangular upper frame and a lower frame, the lower frame is provided with a plurality of rectangular through holes, and locating pin holes are respectively arranged at two ends of every through hole to be used for positioning the antenna lining plate. When the micro connector coated with welding paste is installed in a lining plate mounting hole, the upper frame presses the micro connector, and the part of the upper frame not in contact with the micro connector is provided with a plurality of heat dissipation through holes. According to the welding tool, the micro connector can be welded to the antenna lining plate, and the requirements that no soldering tin occurs on the micro connector and the outer surface of the antenna lining plate after welding can be met.

Description

technical field [0001] The invention relates to the field of reflow soldering. Background technique [0002] In electronic assembly, the connector has a through-hole package and a surface-mount package, while the micro connector mounted on the antenna backing board is neither a through-hole package nor a surface-mount package. Micro-connectors are not installed on printed boards, but on metal structural parts, so they cannot be soldered directly with electric soldering irons, nor can they be soldered with conventional stencil printing techniques. They can only be soldered with special The special solder paste coating tool is used to apply solder paste, and then the soldering tool is used to complete the soldering through the reflow oven. [0003] So far, there have been no relevant reports on this connector welding process in many years of work practice and in the industry. Contents of the invention [0004] In order to overcome the deficiencies of the prior art, the pre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K3/08
CPCB23K1/012B23K3/08B23K3/082B23K2101/36
Inventor 赵明
Owner NO 20 RES INST OF CHINA ELECTRONICS TECH GRP
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