Heat exchanger flow equalizer

Abstract

The invention discloses a heat exchanger flow equalizer which comprises a heat exchanger and an air return box. An air outlet is formed on the lower side of the air return box. A flow equalizing plate is disposed between the heat exchanger and the air return box. The flow equalizing plate is divided into at least two difference areas. A plurality through holes allowing air flow to pass are formed in each area, and the size and / or distribution density of through holes decrease gradually from top to bottom. The heat exchanger flow equalizer has the advantages that the uniformity of the internal flow fields of semiconductor equipment microenvironments, the air flow circulating the heat exchanger is equalized, the utilization rate of the heat exchanger is increased, and the heat exchanger flow equalizer is small in space occupation, good in equalizing effect, simple in structural design, adjustable, and the like.

Description

technical field [0001] The invention relates to the field of heat exchange of semiconductor equipment, in particular to a flow equalizing device, and more particularly to a flow equalizing device for a heat exchanger. Background technique [0002] Semiconductor vertical furnace equipment is a kind of integrated circuit equipment and an important equipment for the production of semiconductor devices. It can be used for oxidation, annealing, chemical vapor deposition and other processes in the manufacturing process of integrated circuits. Since the manufacture of silicon wafers has extremely high requirements on the external environment, especially with the upgrading of the integrated circuit manufacturing process, the requirements for the micro-environment inside the vertical furnace equipment are getting higher and higher. The temperature and flow field are the micro-environment inside the vertical furnace equipment. Two important technical parameters of the environment. ...

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Problems solved by technology

[0004] The main principle of the existing flow equalization device is to design a split air duct in front of the heat exchanger so that the flow field is evenly distributed on the heat exchange air inlet surface, but it occupies a large space. Due to the particularity of the vertical furnace equipment, its heat exchange The split air duct structure cannot be designed on the front side of the furnace, and the compact microenvironment space of the vertical furnace equipment also limits the use of the split air duct structure

Therefore, most of the existing vertical furnace equipment does not improve the efficiency of the heat exchanger through the split air channel structure in the heat exchanger device. The existing solution to the problem is to improve the heat exchanger by designing some simple deflectors. But its current equalization effect is poor

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