Temperature control system and method for semiconductor process heat treatment device

Abstract

The invention relates to a temperature control system and method for a semiconductor process heat treatment device. The system comprises a temperature sensing unit, a temperature signal processing unit, a power output unit, and a power control unit. The temperature sensing unit is used for measuring real-time temperature of the heat treatment device and outputting the temperature. The temperature signal processing unit generates temperature control parameters according to process parameters and the real-time temperature. The temperature control parameters include a command of switching heat treatment device heating and constant temperature phases. The power output unit comprises a first power module and a second power module, and the first and second power modules are used for outputting first and second electric power ranges to the heat treatment device respectively. The power control unit generates a power control parameter and outputs the power control parameter to the first power module in the heat treatment device heating phase or outputs the power control parameter to the second power module in the heat treatment device constant temperature phase. The heating process is performed phase by phase, so that process time can be shortened, energy consumption can be reduced, capacity can be increased and the whole process is best optimized.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing and manufacturing, and more specifically, relates to a temperature control system and a temperature control method for semiconductor process heat treatment equipment. Background technique [0002] With the continuous improvement of semiconductor manufacturing technology and integration, higher requirements are placed on the processing accuracy of the silicon wafer surface and the entire process time, which all depend on the accuracy of temperature control and system response time during the process. [0003] The process of semiconductor manufacturing usually consists of several different "heating-constant temperature-cooling" processes. If these temperature change processes can be better controlled, the process time can be shortened, energy consumption can be reduced, and production capacity can be increased to optimize the entire process. degree of optimization. [0004] In the ...

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Problems solved by technology

[0004] In the prior art, the same temperature control unit is used to control the output of power in the power supply of semiconductor heat treatment equipment in the heating and constant temperature stages. In the case of high process requirements, complex process or large production capacity, it is difficult for such a temperature control strategy to ensure that the heat treatment equipment has both the rapid temperature rise capability in the heating stage and the high-precision temperature control capability in the constant temperature stage, and this contradiction is in low temperature control. particularly obvious

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