Dispensing device and dispensing method

A glue dispensing device and glue dispensing technology, which is applied to the device, installation, optics and other directions of coating liquid on the surface, can solve the problems of low fluidity, unfavorable glue fluidity, unfavorable glue dispensing efficiency, etc., and improve the yield rate. , Improve the effect of dispensing efficiency

Inactive Publication Date: 2017-09-15
SCIENBIZIP CONSULTINGSHENZHENCO
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the actual dispensing process, the viscosity coefficient of the glue is too small, not only the bonding strength is low, but also the fluidity of the glue after dispensing is too large, which is not conducive to controlling the position of the glue flow, so it is generally selected in the dispensing stage of the lens module Glue with higher viscosity, so this kind of glue has better bonding strength than glue with lower viscosity, but the viscosity coefficient of glue is too large, and its fluidity is relatively small, so it needs more for the same lens module Only the number of times of dispensing can ensure that the lens assembly is firmly fixed in the lens barrel, so it is not conducive to the improvement of dispensing efficiency

Method used

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  • Dispensing device and dispensing method
  • Dispensing device and dispensing method

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Embodiment Construction

[0017] The glue dispensing device and glue dispensing method provided by the present invention will be further described in detail below with reference to specific implementation methods and accompanying drawings.

[0018] see Figure 1-2 , figure 1 A glue dispensing device 100 for dispensing glue to a lens module is provided according to the first embodiment of the present invention. The glue dispensing device 100 includes a glue cartridge 10 , an upper end 20 , a glue dispensing portion 30 and a heating device 40 . The upper end 20 is connected to the glue cartridge 10 and the glue dispensing part 30 . The diameter of the upper end portion 20 is smaller than the diameter of the rubber cartridge 10 . The glue cartridge 10 is used to accommodate glue.

[0019] The dispensing part 30 includes a glue head 31 and a glue head 33. The glue head 31 has an upper surface 310 and a lower surface 312. The upper surface 310 is located in the upper end 20, and the lower surface 312 is...

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Abstract

The invention relates to a glue dispensing device, which includes a glue cylinder, an upper end and a glue dispensing part, the upper end connects the glue cartridge and the glue dispensing part, the glue dispensing device also includes a heating device, and the heating device is arranged on The upper end, the heating device includes a heater, a temperature sensor and a controller, the heater is used to heat the glue flowing into the upper end, the temperature sensor is used to sense the heated temperature of the glue, and the controller is connected with the glue respectively. The heater is electrically connected with the temperature sensor, and is used to receive the temperature sensed by the temperature sensor and control the temperature of the glue heated by the heater according to the temperature. The invention also relates to a glue dispensing method.

Description

technical field [0001] The invention relates to the field of glue dispensing technology, in particular to a glue dispensing device and a glue dispensing method for a lens module. Background technique [0002] The glue dispensing process in the lens module assembly section is to use the glue dispensing device to fill the glue to the junction of the lens barrel and the lens or the spacer ring. The strength of the glue after curing makes the two contact tightly and firmly, preventing the inner parts of the lens barrel drop. In the actual dispensing process, the viscosity coefficient of the glue is too small, not only the bonding strength is low, but also the fluidity of the glue after dispensing is too large, which is not conducive to controlling the position of the glue flow, so it is generally selected in the dispensing stage of the lens module Glue with higher viscosity, so this kind of glue has better bonding strength than glue with lower viscosity, but the viscosity coeff...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B7/02B05C9/14B05C11/10B05D1/26
Inventor 林孟东
Owner SCIENBIZIP CONSULTINGSHENZHENCO
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