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Dispensing device and dispensing method

A glue dispensing device and glue dispensing technology, applied to the surface coating liquid device, installation, optics, etc., can solve the problems of low fluidity, unfavorable glue fluidity, low bonding strength, etc., to improve yield, Effect of improving dispensing efficiency

Inactive Publication Date: 2014-03-26
SCIENBIZIP CONSULTINGSHENZHENCO
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the actual dispensing process, the viscosity coefficient of the glue is too small, not only the bonding strength is low, but also the fluidity of the glue after dispensing is too large, which is not conducive to controlling the position of the glue flow, so it is generally selected in the dispensing stage of the lens module Glue with higher viscosity, so this kind of glue has better bonding strength than glue with lower viscosity, but the viscosity coefficient of glue is too large, and its fluidity is relatively small, so it needs more for the same lens module Only the number of times of dispensing can ensure that the lens assembly is firmly fixed in the lens barrel, so it is not conducive to the improvement of dispensing efficiency

Method used

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  • Dispensing device and dispensing method
  • Dispensing device and dispensing method

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Embodiment Construction

[0017] The glue dispensing device and glue dispensing method provided by the present invention will be further described in detail below with reference to specific implementation methods and accompanying drawings.

[0018] see Figure 1-2 , figure 1 A glue dispensing device 100 for dispensing glue to a lens module is provided according to the first embodiment of the present invention. The glue dispensing device 100 includes a glue cartridge 10 , an upper end 20 , a glue dispensing portion 30 and a heating device 40 . The upper end 20 is connected to the glue cartridge 10 and the glue dispensing part 30 . The diameter of the upper end portion 20 is smaller than the diameter of the rubber cartridge 10 . The glue cartridge 10 is used to accommodate glue.

[0019] The dispensing part 30 includes a glue head 31 and a glue head 33. The glue head 31 has an upper surface 310 and a lower surface 312. The upper surface 310 is located in the upper end 20, and the lower surface 312 is...

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Abstract

The invention relates to a dispensing device which comprises a glue tube, an upper end, a dispensing part and a heating device, wherein the upper end is connected with the glue tube and the dispensing part; the heating device is arranged on the upper end and comprises a heater, a temperature sensor and a controller; the heater is used for heating glue flowing into the upper end; the temperature sensor is used for sensing the temperature of the heated glue; the controller is electrically connected with the heater and the temperature sensor respectively and used for receiving the temperature sensed by the temperature sensor so as to control the temperature of the heater heating the glue according to the temperature. The invention also relates to a dispensing method.

Description

technical field [0001] The invention relates to the field of glue dispensing technology, in particular to a glue dispensing device and a glue dispensing method for a lens module. Background technique [0002] The glue dispensing process in the lens module assembly section is to use the glue dispensing device to fill the glue to the junction of the lens barrel and the lens or the spacer ring. The strength of the glue after curing makes the two contact tightly and firmly, preventing the inner parts of the lens barrel drop. In the actual dispensing process, the viscosity coefficient of the glue is too small, not only the bonding strength is low, but also the fluidity of the glue after dispensing is too large, which is not conducive to controlling the position of the glue flow, so it is generally selected in the dispensing stage of the lens module Glue with higher viscosity, so this kind of glue has better bonding strength than glue with lower viscosity, but the viscosity coeff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B7/02B05C9/14B05C11/10B05D1/26
Inventor 林孟东
Owner SCIENBIZIP CONSULTINGSHENZHENCO
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