PCB electroplating method for improving electroplating uniformity

Abstract

The invention discloses a flow diagram of a PCB electroplating method for improving the electroplating uniformity. The PCB electroplating method for improving the electroplating uniformity comprises the steps that firstly, an auxiliary copper block is additionally arranged on a PCB when the PCB is designed; then the PCB is manufactured and etched according to the normal parameters and process; then secondary dry film manufacturing is carried out on the etched PCB, namely all areas, except the area where the copper block is additionally arranged, of the PCB are covered with a dry film photoresist, and the copper block is exposed; the exposed copper block is removed through etching by means of a negative film etching method, and a final circuit graph is formed; the PCB where the final circuit graph is formed is processed according to an existing technological process until a finished product is obtained. By the adoption of the PCB electroplating method for improving the electroplating uniformity, the problem that electroplating and etching are difficult due to the uneven electroplating of a PCB with graphs distributed in an isolated mode is solved, the uniformity of the thickness of electroplating copper of the PCB is improved, and therefore signals can be transmitted more accurately when a user uses the PCB.

Description

technical field [0001] The invention relates to the technical field of PCB processing, in particular to a PCB electroplating method for improving electroplating uniformity. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, printed circuit board, is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. [0003] Due to the current PCB design, the distribution of electroplating patterns is uneven, and there may be only isolated pads or lines locally, while the area of ​​other parts may be too large, or the area of ​​​​the two sides may differ greatly, so that even if the electroplating equipment and solution are good, all parameters are optimal. Conditions, but the actual production of the board may also have uneven plat...

AI Technical Summary

Problems solved by technology

[0006] In view of the shortcomings of the above-mentioned prior art, the purpose of the present invention is to provide a PCB electroplating method for improving the uniformity of electroplating, to solve the problem of uneven electroplating and difficult etching due to isolated electroplating patterns in the prior art

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