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An inner heat pipe heat exchange type semiconductor refrigeration device

A refrigeration device and semiconductor technology, applied in refrigerators, heating methods, refrigeration components, etc., can solve the problems of high operating costs, refrigerant leakage environment, waste of electric energy, etc., to achieve good heat dissipation, cost savings, and guaranteed work The effect of stability

Active Publication Date: 2017-02-01
BEIJING FULLLINK OREITH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the air-conditioning system used to regulate the ambient temperature is mainly composed of indoor heat exchanger and outdoor heat exchanger. This air-conditioning system can realize the temperature regulation of the condensing agent through the high energy consumption of the compressor in the indoor heat exchanger, thereby indirectly changing the indoor temperature. Ambient temperature, this kind of air-conditioning system does not save energy very well, resulting in unnecessary waste of electric energy, high operating costs, and refrigerant leakage often occurs during use, causing pollution to the environment

Method used

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  • An inner heat pipe heat exchange type semiconductor refrigeration device
  • An inner heat pipe heat exchange type semiconductor refrigeration device

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Embodiment Construction

[0016] like figure 1 The schematic diagram of the structure of the internal heat pipe heat exchange semiconductor refrigeration device shown in the present invention includes a semiconductor refrigeration sheet (1), an external heat exchanger (2), an internal heat pipe condenser (3), an internal heat pipe evaporator (4), The external fan (5), the fan (6) of the internal heat pipe evaporator, the air guide tube, the liquid guide tube and the control circuit; the external fan (5) is installed on the external heat exchanger (2), and the external heat exchanger (2) In close contact with the heating surface of the semiconductor cooling sheet (1), the external heat exchanger (2) transmits the useless energy from the heating surface of the semiconductor cooling sheet; the cooling surface of the semiconductor cooling sheet (1) is the same as the inner heat pipe condenser (3) are in close contact with each other; the internal heat pipe condenser (3) is a direct cooling microchannel met...

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Abstract

The invention discloses an inner heat pipe heat-exchange type semiconductor refrigeration device. The refrigeration device mainly comprises a semiconductor refrigeration piece, an outer heat exchanger, an inner heat pipe evaporator, an inner heat pipe condenser, an outer blower, a blower of the inner heat pipe evaporator, an air guide pipe, a liquid guide pipe and a control circuit, wherein the outer blower is mounted on the outer heat exchanger; the outer heat exchanger is tightly contacted with a heating surface of the semiconductor refrigeration piece and transfers unavailable energy of the heating surface of the semiconductor refrigeration piece; a refrigeration surface of the semiconductor refrigeration piece is tightly contacted with the inner heat pipe condenser; the inner heat pipe evaporator is connected with the inner heat pipe condenser through the air guide pipe and the liquid guide pipe, so that a gravity heat pipe system is formed, the heat radiating area of the semiconductor refrigeration surface is increased through the gravity heat pipe heat transfer technology, and the indoor environment temperature is indirectly changed; and a compression refrigeration agent is replaced with the semiconductor refrigeration piece for refrigeration, so that the device is safe, reliable and free from environment pollution.

Description

technical field [0001] The invention belongs to the technical field of cold and heat energy transportation, and relates to an internal heat pipe heat exchange type semiconductor refrigeration device which combines a heat pipe heat exchange system and a semiconductor semiconductor refrigeration sheet to carry out cold and heat energy transportation. Background technique [0002] At present, the air-conditioning system used to regulate the ambient temperature is mainly composed of indoor heat exchanger and outdoor heat exchanger. This air-conditioning system can realize the temperature regulation of the condensing agent through the high energy consumption of the compressor in the indoor heat exchanger, thereby indirectly changing the indoor temperature. Ambient temperature, this kind of air-conditioning system does not save energy very well, which leads to unnecessary waste of electric energy, high operating costs, and refrigerant leakage often occurs during use, causing pollut...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F24F5/00F24F13/30F25B21/02F28D15/02F25B39/02F25B39/04
Inventor 祝长宇丁式平
Owner BEIJING FULLLINK OREITH TECH CO LTD
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