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Light emitting diode device

A technology of light-emitting diodes and substrates, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as lens detachment and peeling, poor bonding strength, and poor reliability

Inactive Publication Date: 2014-01-15
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of common light-emitting diode device usually uses adhesives to bond the lens to the substrate, but the reliability of this structural design is not good, so that the bonding strength between the substrate and the lens is not good, and the lens is easily detached from the substrate peeling off

Method used

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  • Light emitting diode device
  • Light emitting diode device
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Embodiment Construction

[0018] See figure 1 , figure 2 and image 3 The light emitting diode device 10 provided by the embodiment of the present invention includes a substrate 11, a circuit structure 12 formed in the substrate 11, a light emitting diode die 13 and a lens 14 disposed on the substrate 11.

[0019] The substrate 11 can be made of an insulating material, and is used to carry the circuit structure 12, the LED die 13 and the lens 14. The substrate 11 has an upper surface 110 and a lower surface 112 opposite to each other. A rough structure 114 is provided on the upper surface 110 of the substrate 11. The rough structure 114 has a continuous ring shape and is distributed around the LED die 13. Specifically, in this embodiment, the rough structure 114 includes a plurality of spherical protrusions 1140 protrudingly provided on the upper surface 110 of the substrate 11.

[0020] The circuit structure 12 is embedded in the substrate 11 to provide electrical connection to the LED die 13. The circ...

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PUM

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Abstract

A light emitting diode device comprises a substrate with a circuit structure, a light emitting diode grain and a lens, wherein the substrate is provided with the upper surface and the lower surface, the upper surface and the lower surface are arranged oppositely, the upper surface of the substrate is provided with a rough structure, the light emitting diode grain is arranged on the upper surface of the substrate and is electrically connected with the circuit structure, the lens is arranged on the upper surface of the substrate, the light emitting diode grain is covered with the lens, and the lens is in contact with the rough structure on the upper surface of the substrate and is attached to the rough structure in an adhesive mode. The light emitting diode device is strong in binding force between the lens and the substrate, and has the advantage of high reliability.

Description

Technical field [0001] The present invention relates to a semiconductor device, in particular to a light emitting diode device. Background technique [0002] Compared with traditional light-emitting sources, light-emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, low pollution, long life, etc., as a new type of light-emitting source, it has been increasingly applied to In various fields, such as street lights, traffic lights, signal lights, spotlights and decorative lights. [0003] The existing light emitting diode device usually includes a substrate, a light emitting diode die on the substrate, and a lens disposed on the substrate and covering the light emitting diode die. This common light-emitting diode device usually uses adhesive to bond the lens to the substrate, but the reliability of this structural design is not good, making the bonding strength between the substrate and the lens poor, and the lens is easily detached from the su...

Claims

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Application Information

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IPC IPC(8): H01L33/22
CPCH01L2224/48091H01L2924/00014H01L33/486H01L33/58H01L2933/0058
Inventor 黄哲瑄
Owner ZHANJING TECH SHENZHEN
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