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A kind of surface treatment copper foil and preparation method thereof

A surface treatment and copper foil technology, applied in the field of surface treatment copper foil and its preparation, can solve the problems of product quality and performance being difficult to meet use requirements, process parameters being difficult to accurately control, reducing copper foil quality and performance, etc. Controllable, easy to control operating conditions, low production efficiency

Active Publication Date: 2016-04-27
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Combining the brush plating technology with the dealloying technology, giving full play to the respective advantages of the two, and on this basis, developing a coating that does not require a roughened layer and a cured layer made of copper particles and has a high specific surface area on the bonding surface with the resin substrate. High-quality and high-performance surface-treated copper foil, develop a low-cost and efficient surface-treated copper foil preparation method, solve the current surface-treated copper foil that needs to use copper particles for surface roughening and curing, thick copper foil, and high cost , The bonding strength with the resin substrate is low, the quality and performance of the product are difficult to meet the requirements of use, the traditional copper foil substrate pretreatment and surface treatment process is long, the production efficiency is low, the required equipment is complicated, and the energy consumption is high. Problems such as heavy pollution, difficult precise control of process parameters, low level of automated production, and processing will reduce the quality and performance of copper foil itself

Method used

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  • A kind of surface treatment copper foil and preparation method thereof
  • A kind of surface treatment copper foil and preparation method thereof
  • A kind of surface treatment copper foil and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] No. 1 electro-cleaning solution was used, and the copper foil substrate was used as the cathode, and the copper foil substrate was electro-cleaned by brush plating for 30s under the conditions of a voltage of 14-18V, a temperature of 20°C, and a relative movement speed of 0.05m / s of the cathode and anode. , then washed with deionized water. Then use No. 3 activation solution, copper foil substrate as anode, brush plating for 30s under the conditions of voltage 14-18V, temperature 20°C, and relative movement speed of cathode and anode 0.05m / s, to activate the surface of copper foil substrate , then washed with deionized water. Then the composition is ZnSO 4 ·7H 2 O30g / l, NiSO 4 ·6H 2 O100g / l, C 6 H 8 O 7 ·H 2 O50g / l, CH 3 COONa40g / l, Na 2 SO 4 40g / l brush plating solution, brush plating for 90s under the conditions of voltage 14-18V, pH value 2, temperature 20°C, and relative motion speed of cathode and anode of 0.05m / s to obtain zinc-nickel alloy anti-diffusi...

Embodiment 2

[0034] Using No. 1 electrocleaning solution, copper foil substrate as cathode, brush plating for 10s under the conditions of voltage 6~10V, temperature 30°C, and relative movement speed of cathode and anode 0.4m / s, and electrocleaning copper foil substrate , then washed with deionized water. Then use No. 3 activation solution, copper foil substrate as anode, brush plating for 10s under the conditions of voltage 6-10V, temperature 30°C, and relative movement speed of cathode and anode 0.4m / s, to activate the surface of copper foil substrate , then washed with deionized water. Then the composition is ZnSO 4 ·7H 2 O30g / l, NiSO 4 ·6H 2 O25g / l, C 6 H 8 O 7 ·H 2 O65g / l, CH 3 COONa40g / l, Na 2 SO 4 40g / l brush plating solution, brush plating for 30s under the conditions of voltage 6-10V, pH value 3, temperature 30°C, and relative motion speed of cathode and anode 0.4m / s to obtain zinc-nickel alloy anti-diffusion barrier layer, Then wash with deionized water. Followed by t...

Embodiment 3

[0036] No. 1 electro-cleaning solution was used, and the copper foil substrate was used as the cathode, and the copper foil substrate was electro-cleaned by brush plating for 20s under the conditions of a voltage of 10-14V, a temperature of 20°C, and a relative motion speed of 0.2m / s between the cathode and anode. , then washed with deionized water. Then use No. 3 activation solution, copper foil substrate as anode, brush plating for 20s under the conditions of voltage 10-14V, temperature 20°C, and relative movement speed of cathode and anode 0.2m / s, to activate the surface of copper foil substrate , then washed with deionized water. Then the composition is ZnSO 4 ·7H 2 O30g / l, NiSO 4 ·6H 2 O60g / l, C 6 H 8 O 7 ·H 2 O30g / l, CH 3 COONa60g / l, Na 2 SO 4 40g / l brush plating solution, brush plating for 150s under the conditions of voltage 10-14V, pH value 4.5, temperature 20°C, and cathode and anode relative motion speed 0.2m / s, to obtain zinc-nickel alloy anti-diffusion ...

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Abstract

The invention discloses a surface-treated copper foil and a preparation method thereof, which belong to the field of copper foil materials. The surface-treated copper foil is characterized by being formed by an untreated copper foil layer, a zinc-nickel alloy barrier layer, a tin-zinc alloy passivation layer and a porous structure armoring layer, and an organic layer can be immersed and sprayed on the surface of the surface-treated copper foil; the surface of a copper foil substrate can be subjected to electric net treatment, washing, activating treatment, washing, anti-diffusion barrier layer brush electroplating treatment, washing, anti-oxidation passivation layer brush electroplating treatment, washing, armoring layer de-alloying treatment, washing, organic layer treatment and drying in the end. The surface-treated copper foil disclosed by the invention has the advantages that an armoring layer and a solidification layer of a traditional surface-treated copper foil are eliminated, the resource is saved, the copper foil thickness is reduced, the cost of the surface-treated copper foil is reduced, the specific surface area of the surface-treated copper foil is enlarged due to a porous structure of a surface layer, the bonding strength between the surface-treated copper foil and a resin substrate is enhanced, the preparation process is short, the device is simple and environment-friendly, and the quality and the performance of the surface-treated copper foil are high.

Description

technical field [0001] The invention relates to the field of copper foil materials, and in particular provides a surface-treated copper foil and a preparation method thereof. technical background [0002] Copper foil (including rolled copper foil and electrolytic copper foil) is one of the core basic materials for the manufacture of printed circuit boards (Printed Circuit Board, PCB). With the rapid development of the electronic information industry, the use of copper foil is increasing, and the demand for high-performance copper foil is increasing. In practical applications, copper foil and resin substrate are generally pressed into copper clad laminates under high temperature and pressure conditions. In order to ensure sufficient bonding strength between the copper foil and the resin substrate, and prevent the diffusion of copper elements to the resin substrate during high temperature lamination, as well as oxidative discoloration, side corrosion, copper powder falling of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/38C25D5/06C25D5/34C25D7/06
Inventor 刘雪峰王文静谢建新
Owner UNIV OF SCI & TECH BEIJING
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