Process spray nozzle for chip developing process

Abstract

The invention provides a process spray nozzle for a chip developing process. The process spray nozzle for the chip developing process comprises a spray nozzle body and a baffle plate, wherein the spray nozzle body comprises a U-shaped main chamber, and a developing solution inlet and a developing solution outlet which are positioned on two sides of the main chamber and are communicated with the main chamber; the baffle plate has a T-shaped cross section and is inserted into the main chamber; an opening of the main chamber is sealed by the baffle plate; the two T-shaped end surfaces of the baffle plate are adhered to the chamber wall of the main chamber; the developing solution inlet and the developing solution outlet are positioned on the two sides of the baffle plate respectively; and a U-shaped developing solution flow passage is formed in a space between the baffle plate and the main chamber. The process spray nozzle is used for outputting a developing solution in an integrated circuit chip developing process and can solve the problem of non-uniform flow distribution during the conventional developing solution output; the pressure inside the developing solution flow passage in the process spray nozzle is uniform, so that an impact on the working surface of a wafer is small; and the process spray nozzle can be used for forming a relatively long developing line, thus meeting development requirements of the developing process.

Description

technical field [0001] The invention relates to the field of chip developing technology, in particular to a process nozzle used in the chip developing technology. Background technique [0002] At present, the development of the development process requires the wafer diameter to be larger and larger, and the development line width to be smaller and smaller (90nm line width or smaller). This requires that the developing nozzle can perform uniform flow distribution in the length direction of at least 300mm, and requires that the outlet fluid has less impact on the working surface of the wafer. The traditionally used flow distribution structure is a simple T-shaped three-way pipe structure, and holes are opened along the length of the three-way pipe for fluid output. This structure can be used when the diameter of the wafer is small, but as the diameter of the wafer increases, the length of the tee pipe will also increase, and the internal fluid will be larger when it flows fro...

AI Technical Summary

Problems solved by technology

This structure can be used when the diameter of the wafer is small, but as the diameter of the wafer increases, the length of the tee pipe will also increase, and the internal fluid will be larger when it flows from the center to both ends along the pipe. The pressure loss in the extended range causes uneven pressure distribution inside the flow channel, resulting in inconsistent flow of the outflow fluid from the outlet holes distributed along the length direction, which is easy to form local development defects

At the same time, the developer solution flowing out from the small outflow hole has a relatively large flow rate, which will destroy the photoresist shape on the wafer surface and seriously affect the development quality

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