LED chip oblique cutting method, LED light-emitting element and LED lighting device

Abstract

The invention discloses an LED chip miter cutting and connecting method, an LED luminous element and an LED lighting device. The LED chip miter cutting method is characterized by comprising the steps of, during LED chip miter cutting, selecting n (n is an integer larger than 1) LED chips of the same type and removing a substrate of each LED chip, connecting PN junctions of the n LED chips with the substrates removed in series through transparent electrodes and bonding the LED chips into an LED chip lamination body, conducting miter cutting on the LED chip lamination body according to a preset angle alpha between the lamination body and a lamination plate to obtain an LED chip with the luminous face expanded, and encapsulating the LED chip with the luminous face expanded.

Description

technical field [0001] The invention relates to LED lighting technology. Specifically, the present invention relates to a method for cutting and connecting LED chips, an LED light-emitting element made by the cutting and connecting method, and an illuminating device composed of the LED light-emitting element. Background technique [0002] The LED photon extraction method and its extraction efficiency determine the use efficiency and application prospects of lighting devices using LEDs as light sources. Whether the LEDs in the prior art are packaged in millimeter (mm) or micron (μm) level chips, since the path of photons escaping from the active layer of the LED to the space is very complicated, transmission, reflection and absorption will occur during the escape process. And so on, photons are lost in every step of its conduction journey. Therefore, although the internal quantum efficiency of LEDs can reach 100%, the theoretical luminous efficiency reaches about 360lm / W; h...

AI Technical Summary

Problems solved by technology

In addition to complex process operations, (for example, so many chips (such as 25×25 micron chips generally require mounting 1600pis / 1W) must be solidified in the mounting process, wire bonding, phosphor powder, and glue. , although they are all completed by high-speed automatic machinery, but the complexity is high and the overall cost is higher, which directly affects the entry of LED into the field of white light general lighting), and the more difficult problem is the photon side of the 1×1mil (about 25×25 microns) chip The ratio of the area to the lead-out area on the front of the chip is still too small (see Figure 5 of the above-mentioned background technology patent document). Further reducing the chip design area can further improve the light efficiency, but the thickness of the microcrystalline chip is 3 to 4 microns, which is relatively small for 1 For a ×1mil (about 25×25 micron) chip, the side area is only 350 square microns, accounting for only 28% of 25×25×2=1250 square microns; if further improvement of photon extraction efficiency is considered, the size of the chip must be reduced. The ratio of the side lead-out area is greater than that of the front; but in terms of process cost, even the technically feasible cost is not feasible

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