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Passive-driven micro-channel heat-sink cooling device

A heat dissipation cooling and micro-channel technology, which is applied in the cooling/heating device, lighting device, cooling/ventilation/heating renovation of lighting devices, etc., can solve the problem of large dependence on external coolant and power supply, reduce safety and reliability, and restrict popularization and application. and other problems, to achieve the effect of enhancing movement instability and strong cooling and temperature control effects.

Inactive Publication Date: 2013-09-25
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, forced convection cooling of microchannels requires external power devices or auxiliary equipment, which increases the complexity and cost of the system, and relies heavily on external coolant and power supply, which reduces its safety and reliability, and restricts its popularization and application to a certain extent.

Method used

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Embodiment Construction

[0019] The present invention will be further described in detail below in conjunction with specific embodiments and drawings, but the embodiments of the present invention are not limited thereto.

[0020] Such as Figure 1 to Figure 4 As shown, a passively driven microchannel heat dissipation and cooling device according to an embodiment of the present invention is mainly composed of a copper plate heat sink 1 containing a microchannel array and a copper capillary 2 connected to the microchannel 3. The cross section of the microchannel 3 is circular, with a diameter between 0.2 and 1.5mm. The inner diameter of the copper capillary 2 is equal to the diameter of the microchannel 3, and the outer diameter of the copper capillary 2 is with the stepped expansion outside the ports on both sides of the microchannel 3. The diameters are equal, and the sudden expansion 4 and the copper capillary 2 can be plugged and unplugged. The copper capillary tube 2 and the microchannel 3 in the copp...

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Abstract

The invention discloses a passive-driven micro-channel heat-sink cooling device which is used for a high-power microelectronic device or an LED lamp. The passive-driven micro-channel heat-sink cooling device comprises a copper plate piece micro-channel array heat sink, copper capillary tubes and a liquid filling opening. The two ends of each micro-channel in the copper plate piece heat sink respectively comprise a stair-shaped sudden expansion which is used for being directly connected with the outside capillary tubes in a plug-pull mode, and the sudden expansions and the capillary tubes are sealed in a cementing mode or a silver soldering mode. The copper plate piece heat sink and the capillary tubes are connected to form a three-dimensional space structure which can be filled with a certain volume of liquid working media, the liquid working media in the heat-sink micro-channels can generate phase transition and sharp oscillation motion in a heating state, heat is transmitted to the capillary tubes from endothermic working media in the heat sink, heat is dissipated to surroundings through free convection or fan forced convection on the sides of the capillary tubes, and therefore the purpose of heat-sink cooling of a heating device connected with the heat sink is achieved. The passive-driven micro-channel heat-sink cooling device has the advantages of being compact in structure, low in manufacturing cost, free of addition of auxiliary devices and capable of stably operating for a long time.

Description

Technical field [0001] The invention relates to the technical field of heat dissipation and cooling of high-power microelectronic devices or LED lamps, in particular to a passive, that is, a micro-channel cooling device without additional auxiliary devices or device drives. Background technique [0002] In recent years, with the rapid development of microelectronics technology, various information and communication products are achieving high integration and miniaturization at an unprecedented speed, which directly leads to a significant increase in their working heat load and heat generation per unit area. The negative impact of components is great, and the heat dissipation problem has become increasingly prominent, and has become an important bottleneck restricting its development. [0003] The heat dissipation problem also affects high-power LED lights for lighting purposes. If the high-power LED lamp cannot improve the heat dissipation condition and remove the high heat accumu...

Claims

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Application Information

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IPC IPC(8): H05K7/20F21V29/00F21V29/51F21V29/70
Inventor 屈健王谦
Owner JIANGSU UNIV
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