Fixture for sintering semiconductor device and sintering method for plurality of tube cores of semiconductor laser

Abstract

The invention relates to a fixture for sintering a semiconductor device and a sintering method for a plurality of tube cores of a semiconductor laser. The fixture comprises a base, a support frame, a cover plate, lifting columns, springs and fixed columns, wherein the support frame is fixedly arranged on the base; the cover plate is arranged on the support frame; the lifting columns are arranged in slotted holes of the cover plates, and extend to a part below the cover plate; the springs are sleeved on column bodies of the lifting columns, and grooves are formed in the bottom surfaces of the lower ends of the column bodies; the fixed columns are inserted into the grooves; and screw holes are formed in the lower lateral surfaces of the lifting columns; screws are screwed into the screw holes, and are used for blocking the springs, and fixing the fixed columns in the grooves. The semiconductor laser is arranged on a heat sink with a solder, the heat sink is arranged under the fixed columns, pressure is applied to the tube cores through the fixed columns under the action of the springs to well fix the tube cores of the laser and the heat sink, the fixture is covered and sealed through a protective cover, and the fixture and the protective cover are arranged on a heating table for sintering. The fixture is simple in structure; and a plurality of semiconductor lasers can be sintered at one time, so that the production efficiency is improved.

Description

technical field [0001] The invention relates to a semiconductor laser multi-tube core sintering method and a fixture structure, in particular to a laser tube core flip-chip welding method and fixture used in the production of high-power semiconductor lasers, and belongs to the technical field of semiconductor optoelectronics. Background technique [0002] With the development of society and the continuous progress of science and technology, lasers continue to highlight their important status in various fields of society. In particular, semiconductor lasers have the advantages of small size, light weight, high conversion efficiency, long life, and wide wavelength coverage, gradually replacing the market occupied by traditional gas and solid-state lasers, and are widely used in industrial, medical, communication, and military fields. , such as optical fiber communication, laser ranging, material processing, laser guidance, etc. Due to the small size and high power of semicond...

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that only one laser can be sintered at a time and is not suitable for batch sintering

This method can only sinter the C-mount heat sink, and does not apply pressure to the die during sintering. There will be problems such as displacement of the light emitting direction caused by the shift of the die, and uneven contact between the chip and the heat sink, which will affect the stability of the laser. , life and pass rate will cause adverse effects

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