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Circuit board, production method thereof and display device

Active Publication Date: 2013-09-04
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a circuit board, its manufacturing method and a display device to overcome the defects of the existing array substrates such as the decrease in yield due to the thickening of the metal thin film layer.

Method used

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  • Circuit board, production method thereof and display device
  • Circuit board, production method thereof and display device

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Embodiment Construction

[0025] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0026] It should be noted that since the array substrate in the display device is one of the circuit boards, this embodiment uses the array substrate as an example for description, but although the array substrate in the display device is used as an example for description below, however Those skilled in the art should understand that the design of wiring and electrodes disclosed in the present invention can also be applied to various circuit boards including wiring and / or thin film transistors with electrodes. The wiring is not limited to wiring such as gate lines, data lines, or common electrode lines, but can also be any wiring that can be fabricated on a circuit board....

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Abstract

The invention relates to the technical field of display, and in particular to a circuit board, a production method thereof and a display device. The circuit comprises a wiring and / or a thin film transistor with electrodes, wherein at least one of the wiring structure and all the electrode structures of the thin film transistor comprises a first metal layer, a stress adjustment layer and a second metal layer, wherein the stress adjustment layer is positioned between the first metal layer and the second metal layer, the first metal layer and the stress adjustment layer are arranged into a step shape, and the end part of the second metal layer is contacted with the first metal layer. According to the circuit board, the production method thereof and the display device, the stress adjustment layer is additionally arranged between the two metal layers and can reduce the stress of the metal lamination layers, the first metal layer and the stress adjustment layer form the step shape, and accordingly, the resistance of the metal lamination layers can be effectively reduced; and moreover, the breaking probability of subsequent electrodes due to the thickness of the metal layers can be greatly reduced, and the yield of products is improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a circuit board, a manufacturing method thereof and a display device. Background technique [0002] In recent years, with the development of science and technology, liquid crystal display technology has also been continuously improved. TFT-LCD (Thin Film Transistor-Liquid Crystal Display, Thin Film Transistor-Liquid Crystal Display) occupies an important position in the display field due to its advantages of good image display quality, low energy consumption, and environmental protection. [0003] Among them, the aperture ratio has always been an important test index for the performance of TFT-LCD products. In order to achieve a large aperture ratio, a low-resistance laminated film is generally used as the metal electrode. The multi-layer structure will inevitably increase the thickness of the structure, but the greater the thickness, the higher the probability of metal wire f...

Claims

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Application Information

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IPC IPC(8): H01L27/12H01L29/786H01L29/43H01L29/41H01L21/28
CPCH01L21/28008H01L29/42384
Inventor 孙冰
Owner BOE TECH GRP CO LTD
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