An ejector pin assembly for lifting substrates

A technology of ejector rods and components, which is applied in the manufacture of electrical components, semiconductor devices, semiconductor/solid-state devices, etc., can solve problems such as breaking, not falling, deflection, etc., to reduce friction, smooth axial movement, and ensure smooth The effect of moving

Active Publication Date: 2016-03-30
理想万里晖真空装备(泰兴)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide an ejector rod assembly for lifting the substrate, which overcomes the deflection or deformation of the ejector rod of the existing wafer carrier device during the axial movement process in the thin film coating process Problems such as not falling, deflection, or even breaking caused by other reasons, so as to guide the ejector rod to move smoothly and stably in the axial direction during the film coating process, thereby improving the quality of the film coating

Method used

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  • An ejector pin assembly for lifting substrates
  • An ejector pin assembly for lifting substrates
  • An ejector pin assembly for lifting substrates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] refer to image 3 As shown, the ejector pin assembly provided in this embodiment for lifting a substrate includes a ejector pin 1 and a guide device 2 for guiding the ejector pin 1 to move axially.

[0075] The guide device 2 includes a bracket 3, and the bracket 3 includes a through hole 31 that runs through the upper and lower end surfaces of the bracket 3 and is arranged axially along the push rod 1, and the push rod 1 is at least partially located in the through hole 31. Hole 31, so as to move axially. A plurality of guide mechanisms 4 are installed on the support 3 . The plurality of guide mechanisms 4 are arranged on the wall of the through hole 31 and evenly distributed around the push rod 1 . image 3 Among them, the plurality of guide mechanisms 4 are divided into two groups, distributed in a double-layer structure (only two of the guide mechanisms 4 are shown in the figure, and the rest are not shown). Wherein, the guide device 2 further includes an adjustm...

Embodiment 2

[0089] The technical solution of this embodiment is roughly the same as that of the above-mentioned embodiment 1, the difference is that the reference Figure 10 As shown, the adjustment mechanism 5 also includes an auxiliary adjustment plate 57 fixed on the bracket 3 . The auxiliary adjustment plate 57 is located at the other end of the roller 61 of the guide mechanism 6 , and the other end of the roller 61 is against the auxiliary adjustment plate 57 . When the adjustment plate 51 adjusts the position of the roller 62 on the bracket 3, the auxiliary adjustment plate 57 is used in conjunction with the adjustment plate 51 to assist the adjustment plate 51 to adjust the position of the roller. 61 position adjustment, thereby driving the roller 62 to adjust the position relative to the push rod 1 .

[0090] An auxiliary limit frame 33 for placing the auxiliary adjustment plate 57 is opened on the support 3 . Similar to the adjusting plate 51 and the limiting frame 32 in Embodi...

Embodiment 3

[0093] The scheme of this embodiment is roughly the same as that of Embodiment 1, the difference is that the reference Figure 12 As shown, the adjustment mechanism 5 includes an adjustment plate 51, and the adjustment plate 51 is fixed on the support 3; one end of the roller 61 of the guide mechanism 6 controlled by the adjustment mechanism 5 is provided with a spherical curved surface bump 9; The adjustment plate 51 is provided with a bump concave hole 54 matching the structure of the spherical curved surface bump 9 of the roller 61, and the spherical curved surface bump 9 is installed in the bump concave hole 54 to realize the rolling shaft 61. Connect with adjustment mechanism 5.

[0094] The guide mechanism 6 can also include a positioning bushing 63, the other end of the roller 61, that is, the end opposite to the spherical curved surface bump 9, is inserted in the positioning bushing 63, and the positioning shaft The inner diameter of the sleeve 63 is larger than the d...

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PUM

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Abstract

An ejector rod component for lifting a substrate comprises an ejector rod and a guide device used for guiding the ejector rod to axially move, wherein the guide device includes a support, a plurality of guide mechanisms mounted on the support, and a regulating mechanism; the plurality of guide mechanisms are arranged around the ejector rod and limit the position of the ejector rod; the regulating mechanism at least controls one guide mechanism and is used for regulating the radial distance between the ejector rod along the guide mechanism and the ejector rod. According to the invention, the plurality of guide mechanisms are arranged around the ejector rod, so as to guide the ejector rod to axially move and avoid the offset and the breaking of the ejector rod; and in addition, the regulating mechanism not only enables the ejector rod component to be suitable for ejector rods with different diameters, but also can control a distance reserved between the guide mechanisms and the ejector rod via the regulating mechanism so as to effectively solve the problem of unsmooth fall of the ejector rod, which is caused by the deformation of the ejector rod.

Description

technical field [0001] The invention relates to the field of solar cell manufacturing equipment, in particular to a push rod assembly of a wafer carrying device for lifting a substrate. Background technique [0002] In the production process of modern electronic products, such as integrated circuit (IC) production, photovoltaic (solar) equipment or solar cell production process, thin film coating technology is mostly used to grow different thin film layers on the surface of the substrate. The thin film coating technology includes the process of using physical vapor deposition, chemical vapor deposition, physical chemical vapor deposition and other methods to obtain thin film layers with various properties on the surface of metal materials or workpieces. [0003] refer to figure 1 , in the thin film coating process, in a coating chamber 100, the temperature and pressure are controlled under certain conditions, the substrate 101 to be coated is placed on the base 103 of the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18H01L21/683
CPCY02P70/50
Inventor 胡国申
Owner 理想万里晖真空装备(泰兴)有限公司
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