Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Single-point thickness measurement method of SMT screen plate

A technology of thickness measurement and stencil, which is applied in the direction of measuring devices, instruments, and optical devices, etc., can solve the problems of large data errors, inability to represent, and failure to consider the flatness of the stencil, so as to improve measurement accuracy and reduce errors Effect

Inactive Publication Date: 2013-07-24
KUNSHAN THETA MICRO
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The conventional measurement method only takes one point when measuring the thickness of the point, and does not take into account the flatness of the stencil in the vicinity, so it cannot represent the thickness of the position near the point, such as figure 2 As shown, from the cross-section of the stencil, the thickness of the stencil near a certain point will be very different from the thickness of the point
Therefore, using the average value of the point position thickness obtained by this measurement method to represent the thickness of the stencil will lead to large data errors and affect the quality of industrial production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Single-point thickness measurement method of SMT screen plate
  • Single-point thickness measurement method of SMT screen plate
  • Single-point thickness measurement method of SMT screen plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0025] Embodiment 1: within the radius r position range, according to the following image 3 For the movement path set in 1-8 shown, the laser displacement sensor moves to (x, y-r), (x, y+r), (x-r, y), (x+r, y) respectively, and the above four points are taken The thickness of the stencil at the coordinate position, and average the thickness of the stencil at the above four points and the thickness of the stencil at the measured measurement point, and the obtained average value is considered to be the thickness of the stencil at the measurement point.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of laser processing, in particular to a screen plate thickness measurement method. According to the method, the coordinate of a measurement point on a screen plate breadth is (x,y), firstly a laser displacement sensor is moved to the measurement point through shafting motions, measurement is started and thickness data are obtained. The method further includes the following steps: setting a radius r for representing a position range, moving the laser displacement sensor within the position range of the radius r according to a set path, constantly measuring the thickness of the screen plate in the moving process and storing the data until scanning of the laser displacement sensor is completed and the laser displacement sensor returns to the point (x,y), and eventually indicating the thickness of the measurement point with the average value of the obtained thickness data. According to the technical scheme, the thickness of the measured screen plate is obtained, thickness measurement precision of the SMT screen plate is improved, and errors are reduced.

Description

[0001] technical field [0002] The invention relates to the technical field of laser processing, in particular to a method for measuring the thickness of a stencil. [0003] Background technique [0004] In the laser microprocessing industry, it is necessary to measure the thickness of the SMT stencil to check whether the stencil meets the requirements. Generally, a certain number of points are taken at average intervals in the stencil format, and the thickness of these points is measured to represent the average thickness of the stencil, such as figure 1 As shown, the average thickness of 9 points on the screen 1 is taken to represent the thickness of the screen 1 . [0005] The conventional measurement method only takes one point when measuring the thickness of the point, and does not take into account the flatness of the stencil in the vicinity, so it cannot represent the thickness of the position near the point, such as figure 2 As shown, from the cross-section of t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01B11/06
Inventor 魏志凌宁军沈晓
Owner KUNSHAN THETA MICRO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com