Silicon slice conveying device

Abstract

The invention relates to a silicon slice conveying device. The silicon slice conveying device is characterized by comprising a horizontal driving mechanism, a vertical driving mechanism, a rotation driving mechanism, a mechanical arm fork, a prealignment mechanism and a control system. The rotation driving mechanism and the mechanical arm fork are driven by the vertical driving mechanism to move along the vertical direction. The mechanical arm fork is driven by the rotation driving mechanism to rotate and to pick up slices. A spindle driven by a spindle motor is arranged on the front portion of the prealignment mechanism. The upper end of the spindle is connected with a sucking disc, and the lower end of the spindle is communicated with a vacuum pump. A pair of horizontal photoelectric sensors, a pair of vertical photoelectric sensors and an intelligent camera of an electric connection control system are arranged at the front end of the prealignment mechanism. The silicon slice conveying device can be directed at locating slots in silicon slices in the carrying process and read silicon slice information, and the silicon slice conveying device can be widely applied to the carrying process of various types of thinned substrates.

Description

technical field [0001] The invention relates to a mechanical handling device, in particular to a silicon wafer conveying device suitable for taking and delivering thin substrates. Background technique [0002] At present, in the semiconductor silicon wafer manufacturing industry, in order to facilitate the integration of required information on the silicon wafer, a positioning groove is often set on the edge of the circular silicon wafer to indicate the direction of the silicon wafer, and the fixed position relative to the positioning groove is engraved. There is corresponding information of the silicon chip (can be digital symbols, one-dimensional barcode, two-dimensional code, etc.), which is convenient for repeated positioning and information reading of multiple integrated circuit processing. Moreover, due to the influence of the processing environment and the assembly process, it is usually necessary to repeatedly transfer silicon wafers in various process equipment at h...

AI Technical Summary

Problems solved by technology

Now the most used is a manipulator in the form of a three-fold arm. This type of manipulator uses three joint structures of the main arm, the auxiliary arm and the wrist to connect the manipulator fork. flakes cause secondary pollution

There is also a newly developed single-arm and single-fork manipulator. Although this manipulator can avoid the complexity of the joints, it has the same defect as the three-fold arm manipulator: they can only touch silicon wafers. Carry out simple handling operations, and the silicon wafers cannot be arranged according to the positioning grooves or positioning edges set on the silicon wafers

In this way, it is bound to increase the workload of subsequent silicon wafer processing.

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