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Tin plating method

A technology of tin plating and tin plating solution, applied in the field of tin plating, can solve the problems of blackening of the coating, growth of whiskers, affecting product quality and performance, etc., and achieve the effect of high product quality and reasonable process methods.

Inactive Publication Date: 2013-07-03
赵春美
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The popularization of electronic products has increased the demand for lead electronic components. In order to improve the weldability and conductivity of electronic components, the leads of electronic components need to be tinned. However, the current tin plating process is likely to cause blackening of the coating and growth of whiskers. Affect product quality and performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] 1. Preparation of tin plating solution: stannous hydroxymethanesulfonate 10g / L; ethanesulfonic acid 150g / L; ethylene thiourea 50g / L; formaldehyde 50g / L; polyethyleneimine polyethylene glycol 1g / L; Cresol sulfonic acid 1g / L; Hydroxymethane sulfonate 50g / L; Polyoxyethylene fatty alcohol ether 2g / L and the remainder of distilled water.

[0011] 2. Tinning method:

[0012] The raw materials are sequentially subjected to 1, dust and oil removal, 2, pickling and phosphating, 3, water washing, 4, passivation, 5, tin plating, that is, put the product after passivation and cleaning in the tin plating solution at a temperature, and the transmission speed Control at 1~3m / s, current density at 2~5a / dm 2 , 6, water washing, 8, packaging.

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PUM

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Abstract

The invention relates to a tin plating process which is characterized by comprising the following steps of 1. removing dust and oil; 2. pickling and phosphating; 3. washing with water; 4. passivating; 5. plating tin, that is, putting a cleaned product processed by passivation in a tin plating solution with a certain temperature, controlling a conveying speed at 1-3 m / s and a current density at 2-5 a / dm<2>; 6. washing with water; and 7. packaging. The tin plating method is reasonable in process, and a product produced by the method has high quality and is not easy to blacken and grow crystal whiskers.

Description

Technical field [0001] The invention belongs to the technical field of electroplating chemistry, and specifically relates to a tin plating method. Background technique [0002] The popularity of electronic products has increased the demand for lead-type electronic components. In order to improve the solderability and conductivity of electronic components, the leads of electronic components need to be tinned, but the current tin-plating process is likely to cause the coating to blacken and grow whiskers. Affect product quality and performance. Summary of the invention [0003] The purpose of the present invention is to provide a tin plating method with reasonable technology and high quality products that are not easy to turn black and grow whiskers. [0004] The technical scheme adopted by the present invention is: [0005] A tin plating method, characterized in that it comprises the following steps: 1. Dust and oil removal, 2. Pickling and phosphating, 3. Water washing, 4. Passivati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/34C25D3/32
Inventor 赵春美
Owner 赵春美
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