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Steel wire copper preplating electroplating solution

A pre-plating copper and solution technology, applied in the field of pre-plating copper electroplating solution, can solve problems such as poor stability, difficult wastewater treatment, affecting product quality and performance, and achieve good corrosion resistance and tensile strength, environmental protection and pollution-free performance. Reasonable formula effect

Inactive Publication Date: 2013-06-19
蔡成俊
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In order to improve the corrosion resistance and electrical conductivity of the steel wire for electronic components, the steel wire needs to be copper-plated. Before copper-plating, the steel wire needs to be pre-plated with copper to improve the bonding strength and surface finish of the subsequent copper-plated layer. The pre-copper plating solution directly affects the quality and performance of the product. , the current pre-plating solution has poor stability and difficult wastewater treatment

Method used

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Embodiment 1

[0009] A steel wire pre-plating copper electroplating solution, each composition is by weight percentage: KCu 2 150g / L, NaCN250-400g / L%, KCNS150g / L, complexing agent 30g / L%, stabilizer 20g / L%, balance water. The complexing agent is tripotassium citrate, and the regulator is potassium hydroxide. The process conditions are: the temperature of the copper plating solution is controlled at 50°C, the current density is 1.5-2A / dm2, the time is 30S, and the pH value is 10-11.

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Abstract

The invention discloses steel wire copper preplating electroplating solution. The steel wire copper preplating electroplating solution comprises by weight, 150-200g / L KCu2, 250-400g / L% NaCN, 100-200g / L KCNS, 25-50g / L% complexing agent, 10-25g / L% stabilizer and the balance water. The complexing agent is tripotassium citrate, and modifier is potassium hydroxide. According to the steel wire copper preplating electroplating solution, formulation is reasonable, corrosion resistance and tensile strength are good, the plating solution is environment friendly, pollution free and stable in property, and the produced products are high in quality.

Description

technical field [0001] The invention belongs to the technical field of steel wire electroplating solutions, in particular to a pre-plating copper electroplating solution. Background technique [0002] In order to improve the corrosion resistance and electrical conductivity of steel wire for electronic components, the steel wire needs to be copper-plated. Before copper plating, the steel wire needs to be pre-plated with copper to improve the bonding strength and surface finish of the subsequent copper plating layer. The pre-copper plating solution directly affects the quality and performance of the product. , The current pre-plating copper solution has poor stability and difficult wastewater treatment. Contents of the invention [0003] The purpose of the invention is to provide a pre-plating copper electroplating solution with reasonable formula, good corrosion resistance and tensile strength, and stable performance of the plating solution. [0004] Technical solution of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/36C25D7/06
Inventor 蔡成俊
Owner 蔡成俊
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